⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1939702 | 0.87 | PKM (0.35) | — | |
| SCHEMBL4055534 | 0.82 | EPHX2 (0.32) | — | |
| SCHEMBL3850021 | 0.73 | — | — | |
| SCHEMBL4887775 | 0.72 | — | — | |
| SCHEMBL11405480 | 0.69 | PKM (0.44) | — | |
| SCHEMBL8941008 | 0.69 | PKM (0.44) | — | |
| SCHEMBL22660504 | 0.69 | — | — | |
| SCHEMBL14859331 | 0.67 | — | — | |
| SCHEMBL14403170 | 0.67 | — | — | |
| SCHEMBL9905932 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8530596-B2 | Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having same | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-09-10 | — | — | US | disclosed |
| US-8524847-B2 | Organic insulating material, varnish for resin film using the same, resin film and semiconductor device | SUMITOMO BAKELITE CO., LTD. (JP) | 2013-09-03 | — | — | US | disclosed |
| EP-2157107-B1 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO (JP) | 2013-05-08 | — | — | EP | disclosed |
| US-8337982-B2 | Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance | SUMITOMO BAKELITE CO., LTD. (JP) | 2012-12-25 | — | — | US | disclosed |
| EP-2000510-B1 | RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM | SUMITOMO BAKELITE CO (JP) | 2012-05-02 | — | — | EP | disclosed |
| US-20110172351-A1 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2011-07-14 | — | — | US | disclosed |
| US-7863347-B2 | Resin composition, varnish, resin film and semiconductor device using the same | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2011-01-04 | — | — | US | disclosed |
| EP-2177545-A1 | POLYMER FOR FORMING INSULATING FILM, COMPOSITION FOR FORMING INSULATING FILM, INSULATING FILM, AND ELECTRONIC DEVICE HAVING INSULATING FILM | Sumitomo Bakelite Company Limited (JP) | 2010-04-21 | — | — | EP | disclosed |
| EP-2157107-A1 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Co., Ltd. (JP) | 2010-02-24 | — | — | EP | disclosed |
| US-20100004379-A1 | ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-01-07 | — | — | US | disclosed |
| US-7612155-B2 | Film forming composition, insulating film formed by use of the composition, and electronic device | FUJIFILM CORPORATION (JP) | 2009-11-03 | — | — | US | disclosed |
| US-7612155-B2 | Film forming composition, insulating film formed by use of the composition, and electronic device | FUJIFILM CORPORATION (JP) | 2009-11-03 | — | — | US | disclosed |
| US-20090118431-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME | SUMITOMO BAKELITE COMPANY, LTD (JP) | 2009-05-07 | — | — | US | disclosed |
| US-20090030248-A1 | Ethynylphenylbiadamantane derivatives | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2009-01-29 | — | — | US | disclosed |
| EP-2014636-A1 | Ethynylphenylbiadamantane derivatives | Daicel Chemical Industries, Ltd. (JP) | 2009-01-14 | — | — | EP | disclosed |
| EP-2000510-A1 | RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM | Sumitomo Bakelite Company, Ltd. (JP) | 2008-12-10 | — | — | EP | disclosed |
| US-20080206548-A1 | Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device | SUMITOMO BAKELITE CO., LTD (JP) | 2008-08-28 | — | — | US | disclosed |
| US-20070255003-A1 | Film forming composition, insulating film formed by use of the composition, and electronic device | FUJIFILM CORPORATION (JP) | 2007-11-01 | — | — | US | disclosed |
| US-20070255003-A1 | Film forming composition, insulating film formed by use of the composition, and electronic device | FUJIFILM CORPORATION (JP) | 2007-11-01 | — | — | US | disclosed |
| EP-1832619-A1 | BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE | Sumitomo Bakelite Company, Limited (JP) | 2007-09-12 | — | — | EP | disclosed |