SCHEMBL2189752

SCHEMBL2189752

C(#Cc1cc(C#Cc2ccccc2)cc(C23CC4CC(c5cc(C#Cc6ccccc6)cc(C#Cc6ccccc6)c5)(C2)CC(C25CC6(c7cc(C#Cc8ccccc8)cc(C#Cc8ccccc8)c7)CC(c7cc(C#Cc8ccccc8)cc(C#Cc8ccccc8)c7)(CC(c7cc(C#Cc8ccccc8)cc(C#Cc8ccccc8)c7)(C6)C2)C5)(C4)C3)c1)c1ccccc1

nearest known ligand 0.34

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.34
MAPT P10636 1/20 0.33
GRIN2D O15399 2/20 0.32
GRIN3B O60391 2/20 0.32
GRIN1 Q05586 2/20 0.32
GRIN2A Q12879 2/20 0.32
GRIN2B Q13224 2/20 0.32
GRIN2C Q14957 2/20 0.32
GRIN3A Q8TCU5 2/20 0.32
PGR P06401 1/20 0.31
CHRNB2 P17787 1/20 0.31
CHRNB4 P30926 1/20 0.31
CHRNA3 P32297 1/20 0.31
CHRNA7 P36544 1/20 0.31
CHRNA4 P43681 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2190555 0.97 APP (0.36) APPMAPTGRIN2DGRIN3BGRIN1
SCHEMBL2190533 0.92 GRIN2D (0.36) APPMAPTGRIN2DGRIN3BGRIN1
SCHEMBL2191795 0.91 GRIN2D (0.41) APPGRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL2188546 0.89 GRIN2D (0.42) APPGRIN2DGRIN3BGRIN1GRIN2A
SCHEMBL2188330 0.88 APP (0.44) APPMAPT
SCHEMBL2190567 0.85 APP (0.41) APPMAPT
SCHEMBL4064156 0.84 EPHX2 (0.33) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL2189497 0.84 GRIN2D (0.45) APPMAPTGRIN2DGRIN3BGRIN1
SCHEMBL2190193 0.82 PGR (0.33) PGR
SCHEMBL4061258 0.82 GRIN2D (0.43) APPMAPTGRIN2DGRIN3BGRIN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524847-B2 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-09-03 US disclosed
EP-2157107-B1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO (JP) 2013-05-08 EP disclosed
US-20110172351-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2011-07-14 US disclosed
EP-2157107-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2010-02-24 EP disclosed
US-20100004379-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-07 US disclosed
US-20090318610-A1 ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD (JP) 2009-12-24 US disclosed
EP-2117009-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-11 EP disclosed