SCHEMBL2188546

SCHEMBL2188546

C(#Cc1cc(C#Cc2ccccc2)cc(C23CC4CC(C2)CC(C25CC6(c7cc(C#Cc8ccccc8)cc(C#Cc8ccccc8)c7)CC(c7cc(C#Cc8ccccc8)cc(C#Cc8ccccc8)c7)(CC(c7cc(C#Cc8ccccc8)cc(C#Cc8ccccc8)c7)(C6)C2)C5)(C4)C3)c1)c1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
GRIN2D O15399 1/20 0.42
GRIN3B O60391 1/20 0.42
GRIN1 Q05586 1/20 0.42
GRIN2A Q12879 1/20 0.42
GRIN2B Q13224 1/20 0.42
GRIN2C Q14957 1/20 0.42
GRIN3A Q8TCU5 1/20 0.42
PGR P06401 9/20 0.41
ALDH1A1 P00352 3/20 0.35
HSD11B1 P28845 1/20 0.34
ESR1 P03372 1/20 0.33
LMNA P02545 2/20 0.33
APP P05067 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2189497 0.96 GRIN2D (0.45) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL2191795 0.93 GRIN2D (0.41) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL4061258 0.93 GRIN2D (0.43) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL2189752 0.89 APP (0.34) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL2763081 0.89 PGR (0.51) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL2190533 0.86 GRIN2D (0.36) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL2762874 0.86 GRIN2D (0.48) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL2190555 0.86 APP (0.36) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B
SCHEMBL2188330 0.85 APP (0.44) ALDH1A1APP
SCHEMBL2189181 0.83 PGR (0.43) GRIN2DGRIN3BGRIN1GRIN2AGRIN2B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8524847-B2 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-09-03 US disclosed
EP-2157107-B1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO (JP) 2013-05-08 EP disclosed
US-20110172351-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2011-07-14 US disclosed
EP-2157107-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2010-02-24 EP disclosed
US-20100004379-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-07 US disclosed
US-20090318610-A1 ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES SUMITOMO BAKELITE CO., LTD (JP) 2009-12-24 US disclosed
EP-2117009-A1 ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Co., Ltd. (JP) 2009-11-11 EP disclosed