SCHEMBL21911814

SCHEMBL21911814

O=C(OC1CC2CC1CC2C(=O)OCCS(=O)(=O)O)c1cc(I)cc(I)c1I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26068002 0.84 — —
SCHEMBL19756187 0.84 — —
SCHEMBL19756191 0.83 HDAC3 (0.32) —
SCHEMBL19756177 0.83 — —
SCHEMBL23843751 0.82 — —
SCHEMBL19756192 0.81 HDAC3 (0.33) —
SCHEMBL19678504 0.80 — —
SCHEMBL21911813 0.78 HDAC3 (0.30) —
SCHEMBL19756101 0.78 — —
SCHEMBL22403232 0.77 SCN9A (0.30) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230273519-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD JSR CORPORATION (JP) 2023-08-31 — — US disclosed
US-10613437-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-04-07 — — US disclosed
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