SCHEMBL21914310

SCHEMBL21914310

O=C(c1ccccc1CO)N1CCCCC1

nearest known ligand 0.61

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.58
RECQL P46063 1/20 0.58
MEN1 O00255 3/20 0.56
KMT2A Q03164 3/20 0.56
HTT P42858 3/20 0.55
HPGD P15428 3/20 0.53
SMN1; SMN2 Q16637 3/20 0.53
LMNA P02545 1/20 0.53
GLA P06280 1/20 0.51
ALDH1A1 P00352 1/20 0.51
POLB P06746 2/20 0.50
KDM4E B2RXH2 1/20 0.50
GAA P10253 1/20 0.50
MAPT P10636 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8635572 0.98 TSHR (0.60) TSHRRECQLMEN1KMT2AHTT
SCHEMBL21914027 0.87 TSHR (0.55) TSHRRECQLMEN1KMT2AHTT
SCHEMBL8254814 0.85 MEN1 (0.55) TSHRRECQLMEN1KMT2AHTT
SCHEMBL2534156 0.85 MEN1 (0.55) TSHRRECQLMEN1KMT2AHTT
SCHEMBL3086784 0.85 ALDH1A1 (0.51) TSHRRECQLMEN1KMT2AHTT
SCHEMBL8392764 0.85 MEN1 (0.58) TSHRRECQLMEN1KMT2AHTT
SCHEMBL13905030 0.84 HTT (0.57) TSHRRECQLMEN1KMT2AHTT
SCHEMBL7637491 0.83 L3MBTL1 (0.60) TSHRRECQLMEN1KMT2AHTT
SCHEMBL21914032 0.83 TSHR (0.51) TSHRRECQLMEN1KMT2AHTT
SCHEMBL8254849 0.83 TSHR (0.54) TSHRRECQLMEN1KMT2AHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3859447-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2021-08-04 EP disclosed
WO-2020066416-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE 富士フイルム株式会社 2020-04-02 WO disclosed