Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 2/20 | 0.71 |
| ▸ | PTPN22 | Q9Y2R2 | 1/20 | 0.43 |
| ▸ | PLAU | P00749 | 1/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.42 |
| ▸ | MAPKAPK2 | P49137 | 1/20 | 0.42 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.42 |
| ▸ | IDO1 | P14902 | 1/20 | 0.42 |
| ▸ | NQO2 | P16083 | 1/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.41 |
| ▸ | TSHR | P16473 | 2/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.41 |
| ▸ | APP | P05067 | 1/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.41 |
| ▸ | THRB | P10828 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 1/20 | 0.41 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.41 |
| ▸ | CASP1 | P29466 | 1/20 | 0.41 |
| ▸ | SNCA | P37840 | 1/20 | 0.41 |
| ▸ | RECQL | P46063 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 3/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| 1-Naphthol SCHEMBL28672488 | 0.93 | CYP1A2 (0.61) | CYP1A2PTPN22PLAUKDM4EMAPKAPK2 | |
| 1-Naphthol SCHEMBL28329626 | 0.84 | CYP1A2 (0.90) | CYP1A2PTPN22PLAUKDM4EMAPKAPK2 | |
| 1-Naphthol SCHEMBL3416 | 0.84 | CYP1A2 (1.00) | CYP1A2PTPN22PLAUKDM4EMAPKAPK2 | |
| 1-Naphthol SCHEMBL10486461 | 0.84 | CYP1A2 (1.00) | CYP1A2PTPN22PLAUKDM4EMAPKAPK2 | |
| 1-Naphthol SCHEMBL273260 | 0.84 | CYP1A2 (1.00) | CYP1A2PTPN22PLAUKDM4EMAPKAPK2 | |
| 1-Naphthol SCHEMBL29767730 | 0.84 | CYP1A2 (1.00) | CYP1A2PTPN22PLAUKDM4EMAPKAPK2 | |
| 1-Naphthol SCHEMBL8219136 | 0.82 | CYP1A2 (0.94) | CYP1A2PTPN22PLAUKDM4EMAPKAPK2 | |
| 1-Naphthol SCHEMBL11295882 | 0.82 | CYP1A2 (0.94) | CYP1A2PTPN22PLAUKDM4EMAPKAPK2 | |
| 1-Naphthol SCHEMBL9850309 | 0.82 | CYP1A2 (0.94) | CYP1A2PTPN22PLAUKDM4EMAPKAPK2 | |
| 1-Naphthol SCHEMBL21490911 | 0.82 | CYP1A2 (0.94) | CYP1A2PTPN22PLAUKDM4EMAPKAPK2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 133 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109476830-B | Hardener composition and associated forming process, uncured and cured epoxy resin composition, and article | 沙特基础工业全球技术有限公司 | 2021-07-09 | — | — | CN | claimed |
| CN-108290386-B | Method of forming a cured epoxy material, cured epoxy material formed thereby, and composite core incorporating the cured epoxy material | 沙特基础工业全球技术有限公司 | 2021-05-14 | — | — | CN | claimed |
| US-20190241698-A1 | HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2019-08-08 | — | — | US | claimed |
| EP-3487906-A1 | HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE | SABIC Global Technologies B.V. (NL) | 2019-05-29 | — | — | EP | claimed |
| CN-109476830-A | Hardener composition and relevant manufacturing process, uncured and cured composition epoxy resin and product | 沙特基础工业全球技术有限公司 | 2019-03-15 | — | — | CN | claimed |
| US-20180319930-A1 | METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2018-11-08 | — | — | US | claimed |
| CN-108290386-A | It forms the method for cured epoxy material, the cured epoxy material formed by it, useful phenylene ether oligomer-anhydride reaction product and combine the composite material core of cured epoxy material in the method | 沙特基础工业全球技术有限公司 | 2018-07-17 | — | — | CN | claimed |
| WO-2018022262-A1 | HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE | SABIC GLOBAL TECHNOLOGIES B.V. (NL) | 2018-02-01 | — | — | WO | claimed |
| CN-117736548-A | Composite and web | 株式会社力森诺科 | 2024-03-22 | — | — | CN | disclosed |
| CN-112166154-B | Composite and molded article | 株式会社力森诺科 | 2024-02-20 | — | — | CN | disclosed |
| CN-111386295-B | Composite and web | 株式会社力森诺科 | 2024-01-09 | — | — | CN | disclosed |
| CN-111961312-B | Resin composition, prepreg, insulating film, metal foil-clad laminate, and printed wiring board each comprising the same | 苏州生益科技有限公司 | 2023-09-12 | — | — | CN | disclosed |
| CN-112955515-B | Curable resin composition | 株式会社艾迪科 | 2023-04-14 | — | — | CN | disclosed |
| CN-111849123-B | Epoxy resin composition and application thereof | 常熟生益科技有限公司 | 2022-12-09 | — | — | CN | disclosed |
| US-20060019195-A1 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-01-26 | — | — | US | disclosed |
| US-20060014106-A1 | Photoresist undercoat-forming material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. | 2006-01-19 | — | — | US | disclosed |
| US-20050282091-A1 | Patterning process and undercoat-forming material | SHIN-ETSU CHEMICAL CO.,LTD. (JP) | 2005-12-22 | — | — | US | disclosed |
| US-20050282091-A1 | Patterning process and undercoat-forming material | SHIN-ETSU CHEMICAL CO.,LTD. (JP) | 2005-12-22 | — | — | US | disclosed |
| US-20040259037-A1 | Resist lower layer film material and method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-23 | — | — | US | disclosed |
| US-20040241577-A1 | Resist lower layer film material and method for forming a pattern | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-12-02 | — | — | US | disclosed |