Maleic Anhydride

Maleic Anhydride

SCHEMBL219660

C1=CC2CCC1C2.O=C1C=CC(=O)O1

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Maleic Anhydride SCHEMBL8927164 0.98
Maleic Anhydride SCHEMBL8927155 0.98
Maleic Anhydride SCHEMBL7070902 0.84 LMNA (0.33)
Benzoquinone SCHEMBL984234 0.75 MAOA (0.42)
Maleic Anhydride SCHEMBL191 0.72
SCHEMBL22129636 0.72
SCHEMBL6065835 0.72
Maleic Anhydride SCHEMBL1332547 0.72
SCHEMBL81839 0.72
Maleic Anhydride SCHEMBL1332137 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9983477-B2 Polymers and photoresist compositions ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2018-05-29 US claimed
US-8802063-B2 Cosmetic composition AVON PRODUCTS, INC. (US) 2014-08-12 US claimed
EP-2658555-A1 COSMETIC COMPOSITION Avon Products, Inc. (US) 2013-11-06 EP claimed
CN-102702432-A Catalyst for use in ternary polymerization of norbornene, maleic anhydride and cyclohexene and ternary polymerization method UNIV NINGBO TECHNOLOGY 2012-10-03 CN claimed
WO-2012091826-A1 COSMETIC COMPOSITION AVON PRODUCTS, INC. (US) 2012-07-05 WO claimed
US-20120171131-A1 Cosmetic Composition AVON PRODUCTS, INC. (US) 2012-07-05 US claimed
US-7332444-B2 Method for smoothing areas in structures by utilizing the surface tension INFINEON TECHNOLOGIES AG (DE) 2008-02-19 US claimed
US-20050214467-A1 Method for smoothing areas in structures by utilizing the surface tension INFINEON TECHNOLOGIES AG (DE) 2005-09-29 US claimed
CN-116693755-B ArF photoresist film-forming polymer, preparation method thereof, photoresist prepared from polymer and application of polymer 瑞红(苏州)电子化学品股份有限公司 2024-03-29 CN disclosed
CN-116693755-A ArF photoresist film-forming polymer, preparation method thereof, photoresist prepared from polymer and application of polymer 瑞红(苏州)电子化学品股份有限公司 2023-09-05 CN disclosed
CN-112574705-B Ultrahigh-bonding-force adhesive for semiconductor assembly 上海佰奥聚新材料科技有限公司 2022-08-09 CN disclosed
CN-110875175-B Method for manufacturing semiconductor device 台湾积体电路制造股份有限公司 2022-06-10 CN disclosed
CN-112574705-A Ultrahigh-bonding-force adhesive for semiconductor assembly 上海佰奥聚新材料科技有限公司 2021-03-30 CN disclosed
CN-112327577-A Bottom antireflective coating 台湾积体电路制造股份有限公司 2021-02-05 CN disclosed
US-7332444-B2 Method for smoothing areas in structures by utilizing the surface tension INFINEON TECHNOLOGIES AG (DE) 2008-02-19 US disclosed
US-20050214467-A1 Method for smoothing areas in structures by utilizing the surface tension INFINEON TECHNOLOGIES AG (DE) 2005-09-29 US disclosed
EP-0212652-B1 Thermally adoptive polymers and prepolymers and method of making them THERMAL SCIENCE INC (US) 1996-10-23 EP disclosed
US-4748255-A DIAMIC ACID OLIGOMER, POLYIMIDE FOAMS THERMAL SCIENCE, INC. (US) 1988-05-31 US disclosed
US-4687785-A Thermally adaptive polymers and prepolymers and methods of making in which an imide is formed from a polyanhydride oligomer and an isocyanate THERMAL SCIENCE, INC. (US) 1987-08-18 US disclosed
EP-0212652-A2 Thermally adoptive polymers and prepolymers and method of making them THERMAL SCIENCE, INC. (US) 1987-03-04 EP disclosed