SCHEMBL21990259

SCHEMBL21990259

[Cu].c1cnc2nn[nH]c2c1

nearest known ligand 0.42

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
NUDT1 P36639 1/20 0.42
METAP1 P53582 2/20 0.38
METAP2 P50579 1/20 0.38
PARP1 P09874 1/20 0.35
PDE5A O76074 3/20 0.35
AURKA O14965 5/20 0.34
KCNMA1 Q12791 1/20 0.33
TP53 P04637 1/20 0.33
ADORA3 P0DMS8 1/20 0.33
ADORA2A P29274 1/20 0.33
PSMD14 O00487 1/20 0.33
GRM4 Q14833 1/20 0.33
HPGD P15428 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29376620 0.98
SCHEMBL40861 0.98
SCHEMBL27759739 0.96 NUDT1 (0.42) NUDT1METAP1METAP2PARP1PDE5A
SCHEMBL28611928 0.96 NUDT1 (0.42) NUDT1METAP1METAP2PARP1PDE5A
SCHEMBL8038689 0.96 NUDT1 (0.42) NUDT1METAP1METAP2PARP1PDE5A
Hydrochloric Acid SCHEMBL29236109 0.96 NUDT1 (0.42) NUDT1METAP1METAP2PARP1PDE5A
Iodide SCHEMBL16585403 0.96 NUDT1 (0.42) NUDT1METAP1METAP2PARP1PDE5A
Pyrazine SCHEMBL27939229 0.92 NUDT1 (0.40) NUDT1METAP1METAP2PARP1PDE5A
SCHEMBL29948103 0.92 NUDT1 (0.40) NUDT1METAP1METAP2PARP1PDE5A
SCHEMBL937094 0.90 NUDT1 (0.39) NUDT1METAP1METAP2PARP1PDE5A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3891234-A1 COMPOSITION AND METHOD FOR COPPER BARRIER CMP CMC Materials, Inc. (US) 2021-10-13 EP disclosed
CN-113396197-A Compositions and methods for chemical mechanical polishing of copper barriers CMC材料股份有限公司 2021-09-14 CN disclosed
US-10988635-B2 Composition and method for copper barrier CMP CMC MATERIALS, INC. (US) 2021-04-27 US disclosed
WO-2020117441-A1 COMPOSITION AND METHOD FOR COPPER BARRIER CMP CABOT MICROELECTRONICS CORPORATION (US) 2020-06-11 WO disclosed
US-20200172762-A1 COMPOSITION AND METHOD FOR COPPER BARRIER CMP CMC MATERIALS LLC 2020-06-04 US disclosed