SCHEMBL21993468

SCHEMBL21993468

OCc1ccc(-c2ccc(-c3ccc(Oc4ccc(-c5ccc(-c6ccccc6)cc5)cc4)cc3)cc2)cc1

nearest known ligand 0.80

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ LTA4H P09960 2/20 0.80
▸ TSHR P16473 2/20 0.52
▸ TTR P02766 1/20 0.50
▸ FYN P06241 1/20 0.49
▸ MKNK1 Q9BUB5 1/20 0.48
▸ MKNK2 Q9HBH9 1/20 0.48
▸ MMP12 P39900 1/20 0.47
▸ MMP13 P45452 1/20 0.47
▸ FFAR1 O14842 1/20 0.47
▸ GSTP1 P09211 2/20 0.47
▸ PPARG P37231 2/20 0.46
▸ PPARA Q07869 2/20 0.46
▸ SRD5A2 P31213 1/20 0.46
▸ S1PR1 P21453 1/20 0.46
▸ S1PR3 Q99500 1/20 0.46
▸ ABCC4 O15439 1/20 0.45
▸ LMNA P02545 1/20 0.45
▸ GAA P10253 1/20 0.45
▸ PTGS1 P23219 1/20 0.45
▸ HTT P42858 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1745252 1.00 LTA4H (0.80) LTA4HTSHRTTRFYNMKNK1
SCHEMBL510065 0.89 LTA4H (1.00) LTA4HTSHRTTRFYNFFAR1
SCHEMBL1744936 0.89 LTA4H (1.00) LTA4HTSHRTTRFYNFFAR1
SCHEMBL28009007 0.87 LTA4H (0.95) LTA4HTSHRTTRFYNFFAR1
SCHEMBL28009008 0.87 LTA4H (0.95) LTA4HTSHRTTRFYNFFAR1
SCHEMBL11274656 0.87 TSHR (0.68) LTA4HTSHRFYNMKNK1MKNK2
SCHEMBL70274 0.87 TSHR (0.68) LTA4HTSHRFYNMKNK1MKNK2
Biphenyl SCHEMBL27280595 0.87 TSHR (0.68) LTA4HTSHRFYNMKNK1MKNK2
SCHEMBL14173672 0.86 LTA4H (0.70) LTA4HTSHRTTRFYNMMP12
SCHEMBL5342317 0.84 LTA4H (0.81) LTA4HTSHRTTRFFAR1PPARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200148538-A1 SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER FUJIFILM CORPORATION (JP) 2020-05-14 — — US disclosed
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