SCHEMBL21993643

SCHEMBL21993643

Fc1ccc(OCc2ccc(-c3ccc(-c4ccccc4)cc3)cc2)cc1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GSTP1 P09211 1/20 0.63
MAOB P27338 7/20 0.62
APP P05067 1/20 0.62
NR4A2 P43354 1/20 0.60
FFAR1 O14842 1/20 0.59
GPR34 Q9UPC5 1/20 0.59
MEN1 O00255 1/20 0.56
ALDH1A1 P00352 1/20 0.56
RECQL P46063 1/20 0.56
KMT2A Q03164 1/20 0.56
NPC1 O15118 1/20 0.55
RAB9A P51151 1/20 0.55
BCL2L1 Q07817 1/20 0.54
MCL1 Q07820 1/20 0.54
CA12 O43570 1/20 0.54
CA1 P00915 1/20 0.54
CA2 P00918 1/20 0.54
CA7 P43166 1/20 0.54
CA9 Q16790 1/20 0.54
PARP10 Q53GL7 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27854180 0.89 MEN1 (0.57) GSTP1MAOBAPPNR4A2GPR34
SCHEMBL6927496 0.88 MAOB (0.66) MAOBAPPNR4A2MEN1ALDH1A1
SCHEMBL4337813 0.88 MEN1 (0.68) MAOBAPPNR4A2MEN1ALDH1A1
SCHEMBL12285274 0.86 GSTP1 (0.68) GSTP1MAOBAPPFFAR1ALDH1A1
SCHEMBL1096817 0.86 LMNA (0.69) GSTP1MAOBNR4A2FFAR1MEN1
SCHEMBL23483029 0.86 LMNA (0.69) GSTP1MAOBNR4A2FFAR1MEN1
SCHEMBL23665904 0.86 GSTP1 (0.68) GSTP1MAOBAPPFFAR1ALDH1A1
SCHEMBL27550091 0.86 MAOB (0.80) MAOBAPPNR4A2NPC1RAB9A
SCHEMBL11840257 0.85 MAOB (0.62) MAOBAPPNR4A2MEN1ALDH1A1
SCHEMBL11852684 0.85 MAOB (0.62) MAOBAPPNR4A2FFAR1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200148538-A1 SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER FUJIFILM CORPORATION (JP) 2020-05-14 US disclosed