⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1781553 | 0.78 | — | — | |
| SCHEMBL5028585 | 0.78 | — | — | |
| SCHEMBL27780983 | 0.78 | ALDH1A1 (0.34) | — | |
| SCHEMBL371451 | 0.77 | HSD17B10 (0.30) | — | |
| SCHEMBL5030081 | 0.76 | HSD17B10 (0.33) | — | |
| SCHEMBL160479 | 0.76 | — | — | |
| SCHEMBL9798616 | 0.73 | HSD17B10 (0.35) | — | |
| SCHEMBL3400816 | 0.72 | HSD17B10 (0.30) | — | |
| SCHEMBL3851055 | 0.72 | — | — | |
| SCHEMBL9798624 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025127152-A1 | METAL OXIDE PARTICLES HAVING IMPROVED HYDROPHOBICITY, HIGHLY CONCENTRATED METAL OXIDE SOL, AND METHODS FOR PRODUCING SAME | 日産化学株式会社 | 2025-06-19 | — | — | WO | disclosed |
| US-20240400825-A1 | RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELECTROSTATIC CHUCK, AND PLASMA PROCESSING EQUIPMENT | TORAY INDUSTRIES, INC. (JP) | 2024-12-05 | — | — | US | disclosed |
| WO-2023068044-A1 | RESIN COMPOSITION, CURED PRODUCT THEREOF, LAMINATE USING SAME, ELECTROSTATIC CHUCK, AND PLASMA PROCESSING DEVICE | 東レ株式会社 | 2023-04-27 | — | — | WO | disclosed |
| EP-1630605-B1 | PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2017-10-11 | — | — | EP | disclosed |
| EP-1508837-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM | TORAY INDUSTRIES (JP) | 2014-10-15 | — | — | EP | disclosed |
| EP-1862855-B1 | PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2011-10-05 | — | — | EP | disclosed |
| US-7977400-B2 | polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation | TORAY INDUSTRIES, INC. (JP) | 2011-07-12 | — | — | US | disclosed |
| EP-1475665-B1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES (JP) | 2009-12-30 | — | — | EP | disclosed |
| US-7476476-B2 | Photosensitive resin composition, electronic component using the same, and display unit using the same | TORAY INDUSTRIES, INC. (JP) | 2009-01-13 | — | — | US | disclosed |
| US-20080108723-A1 | Photosensitive Resin Composition | TORAY INDUSTRIES, INC. (JP) | 2008-05-08 | — | — | US | disclosed |
| US-20060159839-A1 | Photosensitive resin composition, electronic component using the same, and display using same | TORAY INDUSTRIES, INC. (JP) | 2006-07-20 | — | — | US | disclosed |
| EP-1630605-A1 | PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT AND DISPLAY USING SAME | TORAY INDUSTRIES, INC. (JP) | 2006-03-01 | — | — | EP | disclosed |
| US-20050202337-A1 | Photosensitive resin composition and method for preparing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2005-09-15 | — | — | US | disclosed |
| US-6929890-B2 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2005-08-16 | — | — | US | disclosed |
| US-6887643-B2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-05-03 | — | — | US | disclosed |
| EP-1508837-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM | TORAY INDUSTRIES, INC. (JP) | 2005-02-23 | — | — | EP | disclosed |
| EP-1475665-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-11-10 | — | — | EP | disclosed |
| US-20040197703-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-10-07 | — | — | US | disclosed |
| US-20040053156-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-03-18 | — | — | US | disclosed |
| EP-1388758-A1 | Photosensitive heat resistant resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-02-11 | — | — | EP | disclosed |