Malic Acid

Malic Acid

SCHEMBL220041

O=C(O)CC(O)C(=O)O.[Ag]

nearest known ligand 0.94

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Known targets — ChEMBL curated mechanism

CACNA1CCACNA1DCACNA1FCACNA1SDRD2HTR1BHTR1DHTR1F

The experimentally established mechanism targets of Malic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
▸ SMN1; SMN2 Q16637 1/20 0.94
▸ SLC22A6 Q4U2R8 1/20 0.53
▸ TET2 Q6N021 6/20 0.52
▸ TET3 O43151 2/20 0.52
▸ TET1 Q8NFU7 1/20 0.52
▸ KDM4A O75164 2/20 0.50
▸ KDM4C Q9H3R0 2/20 0.50
▸ KDM2A Q9Y2K7 2/20 0.50
▸ OR51E2 Q9H255 1/20 0.50
▸ TDP1 Q9NUW8 1/20 0.50
▸ GABRR1 P24046 2/20 0.43
▸ LMNA P02545 1/20 0.43
▸ KMO O15229 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Malic Acid SCHEMBL30942581 1.00 SMN1; SMN2 (0.94) SMN1; SMN2SLC22A6TET2TET3TET1
Malic Acid SCHEMBL30821936 1.00 SMN1; SMN2 (0.94) SMN1; SMN2SLC22A6TET2TET3TET1
Malic Acid SCHEMBL31673494 0.97 — —
Malic Acid SCHEMBL89131 0.97 SMN1; SMN2 (1.00) SMN1; SMN2SLC22A6TET2TET3TET1
Malic Acid SCHEMBL256122 0.97 — —
Malic Acid SCHEMBL31673489 0.97 — —
Malic Acid SCHEMBL98496 0.97 — —
Malic Acid SCHEMBL856 0.97 — —
Malic Acid SCHEMBL14125844 0.97 SMN1; SMN2 (1.00) SMN1; SMN2SLC22A6TET2TET3TET1
Malic Acid SCHEMBL30036315 0.97 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 136 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4604912-A1 NATURAL SUBSTANCE-BASED HAIR DYEING METHOD Henkel AG & Co. KGaA (DE) 2025-08-27 — — EP claimed
CN-118253761-A Nano-micro solid silver flake capable of being sintered at low temperature and preparation method and application thereof 深圳市百柔新材料技术有限公司 2024-06-28 — — CN claimed
WO-2024083438-A1 NATURAL SUBSTANCE-BASED HAIR DYEING METHOD HENKEL AG & CO. KGAA (DE) 2024-04-25 — — WO claimed
CN-114914011-B Repairing type silver-coated copper powder and preparation method thereof, electronic paste and preparation method thereof 苏州思尔维纳米科技有限公司 2024-03-08 — — CN claimed
CN-114220588-B HIT low-temperature silver paste for ink-jet printing and preparation method thereof 苏州思尔维纳米科技有限公司 2024-02-09 — — CN claimed
CN-117497224-A Sintered silver paste, sintered silver film preformed sheet and application thereof 深圳先进电子材料国际创新研究院 2024-02-02 — — CN claimed
CN-115410749-A Silver paste and preparation method and application thereof 苏州诺菲纳米科技有限公司 2022-11-29 — — CN claimed
CN-115376719-A Low-temperature silver-coated copper paste for solar cell 苏州诺菲纳米科技有限公司 2022-11-22 — — CN claimed
CN-114914011-A Repairing silver-coated copper powder and preparation method thereof, and electronic paste and preparation method thereof 苏州思尔维纳米科技有限公司 2022-08-16 — — CN claimed
CN-114532359-A Stable composition, application thereof and product containing same 北京洁尔爽高科技有限公司 2022-05-27 — — CN claimed
EP-3028792-A1 NANO-SILVER POWDER, THE PREPARATION METHOD AND APPLICATION IN PREPARATION OF ELECTRICALLY CONDUCTIVE INK OF THE SAME AND ELECTRICALLY CONDUCTIVE INK Institute Of Chemistry, Chinese Academy Of Sciences (CN) 2016-06-08 — — EP claimed
US-20160152851-A1 Method for Preparing Nano-Silver Powder and Application in Preparation of Electrically Conductive Ink of the Nano-Silver Powder and Electrically Conductive Ink INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES (CN) 2016-06-02 — — US claimed
CN-101529532-B A silver paste for forming conductive layers EXAX INC 2010-12-15 — — CN claimed
US-20100193751-A1 Silver Paste for Forming Conductive Layers EXAX, Inc. 2010-08-05 — — US claimed
EP-2126932-A1 A SILVER PASTE FOR FORMING CONDUCTIVE LAYERS Exax Inc. (KR) 2009-12-02 — — EP claimed
CN-101529532-A A silver paste for forming conductive layers EXAX INC (KR) 2009-09-09 — — CN claimed
WO-2008093913-A1 A SILVER PASTE FOR FORMING CONDUCTIVE LAYERS EXAX INC. (KR) 2008-08-07 — — WO claimed
US-20070149792-A1 Catalyst for epoxidation of an alkene to an alkene oxide, method of making and method of using thereof SAUDI BASIC INDUSTRIES CORPORATION 2007-06-28 — — US claimed
US-20050027133-A1 Method of making a catalyst for direct oxidation of an alkene to an alkene oxide SAUDI BASIC INDUSTRIES CORPORATION 2005-02-03 — — US claimed
US-20050027134-A1 Support for a catalyst for direct oxidation of propylene to propylene oxide, method of making and method of using catalyst SAUDI BASIC INDUSTRIES CORPORATION 2005-02-03 — — US claimed
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