SCHEMBL22004264

SCHEMBL22004264

O=C(Oc1ccc(-c2ccc(-c3ccccc3)cc2)cc1)c1c(F)c(F)c(F)c(F)c1F

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.48
MEN1 O00255 3/20 0.48
TDP1 Q9NUW8 2/20 0.48
MAPT P10636 2/20 0.48
SMN1; SMN2 Q16637 2/20 0.45
LMNA P02545 2/20 0.45
NPSR1 Q6W5P4 1/20 0.45
FABP7 O15540 1/20 0.43
FABP3 P05413 1/20 0.43
FABP5 Q01469 1/20 0.43
KDM4E B2RXH2 1/20 0.43
NPC1 O15118 1/20 0.43
RAB9A P51151 1/20 0.43
L3MBTL1 Q9Y468 1/20 0.43
GAA P10253 3/20 0.42
CYP1A2 P05177 2/20 0.42
CYP2C19 P33261 2/20 0.42
CYP2C9 P11712 1/20 0.42
PKM P14618 1/20 0.42
PARP10 Q53GL7 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2835534 0.89 HPGD (0.50) TDP1MAPTSMN1; SMN2LMNANPSR1
SCHEMBL25696004 0.81 PARP10 (0.39) KMT2AMEN1TDP1MAPTNPSR1
SCHEMBL2833915 0.81 KMT2A (0.49) KMT2AMEN1MAPTSMN1; SMN2KDM4E
SCHEMBL2356535 0.81 ELANE (0.44) KMT2AMEN1MAPTSMN1; SMN2RAB9A
Biphenyl SCHEMBL7938918 0.81 GAA (0.46) KMT2AMEN1MAPTSMN1; SMN2LMNA
SCHEMBL532804 0.78 LMNA (0.53) KMT2AMEN1MAPTSMN1; SMN2LMNA
SCHEMBL10794582 0.77 PARP10 (0.57) KMT2AMEN1TDP1MAPTRAB9A
SCHEMBL2638440 0.77 PARP10 (0.67) KMT2AMEN1TDP1MAPTSMN1; SMN2
SCHEMBL5710451 0.77 PARP10 (0.67) KMT2AMEN1TDP1MAPTSMN1; SMN2
SCHEMBL29067670 0.77 HPGD (0.60) KMT2AMEN1TDP1MAPTSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3653575-A1 SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE PROVIDED WITH THERMALLY CONDUCTIVE LAYER FUJIFILM Corporation (JP) 2020-05-20 EP disclosed