SCHEMBL2201239

SCHEMBL2201239

CC(OC(=O)NC1CCCCC1)c1ccccc1[N+](=O)[O-]

nearest known ligand 0.51

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 8/20 0.51
GAA P10253 2/20 0.51
KMT2A Q03164 4/20 0.49
RAB9A P51151 3/20 0.47
NPC1 O15118 2/20 0.47
MEN1 O00255 3/20 0.46
L3MBTL1 Q9Y468 2/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
MAPT P10636 2/20 0.46
KDM4E B2RXH2 1/20 0.46
EPHX2 P34913 1/20 0.44
MITF O75030 1/20 0.43
LMNA P02545 1/20 0.43
THRB P10828 1/20 0.43
MAPK1 P28482 1/20 0.43
NPSR1 Q6W5P4 1/20 0.43
TDP1 Q9NUW8 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2674734 0.88 ALDH1A1 (0.53) ALDH1A1GAAKMT2ARAB9ANPC1
SCHEMBL13791412 0.87 ALDH1A1 (0.47) ALDH1A1GAAKMT2ARAB9ANPC1
SCHEMBL2675822 0.87 KMT2A (0.53) ALDH1A1GAAKMT2ARAB9ANPC1
SCHEMBL2200612 0.85 EPHX1 (0.47) ALDH1A1KMT2ARAB9ANPC1MEN1
SCHEMBL13172144 0.85 ALDH1A1 (0.50) ALDH1A1GAAKMT2ARAB9ANPC1
SCHEMBL793383 0.83 ALDH1A1 (0.43) ALDH1A1GAAKMT2ARAB9ANPC1
SCHEMBL542086 0.81 ALDH1A1 (0.55) ALDH1A1GAAKMT2ARAB9ANPC1
SCHEMBL10048309 0.81 ALDH1A1 (0.41) ALDH1A1GAAKMT2ARAB9ANPC1
SCHEMBL7905311 0.81 ALDH1A1 (0.45) ALDH1A1KMT2ARAB9ANPC1MEN1
SCHEMBL2674274 0.80 KMT2A (0.53) ALDH1A1GAAKMT2ARAB9ANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8367190-B2 At low temperature, fast hardening composition for preparing protecting film, protecting film prepared therefrom, and substrate comprising the same LG CHEM, LTD. (KR) 2013-02-05 US claimed
US-20100080973-A1 LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEM, LTD. (KR) 2010-04-01 US claimed
WO-2008035890-A9 AT LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEMICAL LTD (KR) 2009-04-23 WO claimed
WO-2008035890-A1 AT LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEM, LTD. (KR) 2008-03-27 WO claimed
EP-3374467-B1 COMPOSITIONS OF PHOTO-ALIGNABLE MATERIALS ROLIC TECH AG (CH) 2020-04-15 EP disclosed
EP-3081612-B1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO LTD (JP) 2018-11-14 EP disclosed
US-20180320072-A1 COMPOSITIONS OF PHOTO-ALIGNABLE MATERIALS Rolic Technologies AG (CH) 2018-11-08 US disclosed
EP-3374467-A1 COMPOSITIONS OF PHOTO-ALIGNABLE MATERIALS ROLIC Technologies AG (CH) 2018-09-19 EP disclosed
US-9718999-B2 Photocurable composition having adhesive properties CEMEDINE CO., LTD (JP) 2017-08-01 US disclosed
WO-2017080977-A1 COMPOSITIONS OF PHOTO-ALIGNABLE MATERIALS ROLIC AG (CH) 2017-05-18 WO disclosed
US-20160312089-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO., LTD. (JP) 2016-10-27 US disclosed
EP-3081612-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES Cemedine Co., Ltd. (JP) 2016-10-19 EP disclosed
EP-1909142-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER TORAY INDUSTRIES, INC. (JP) 2008-04-09 EP disclosed
US-7354521-B2 Method of fabricating inkjet print head using photocurable resin composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-04-08 US disclosed
WO-2008035890-A1 AT LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEM, LTD. (KR) 2008-03-27 WO disclosed
EP-0633502-B1 PATTERN FORMING MATERIAL CLARIANT FINANCE BVI LTD (VG) 2002-03-20 EP disclosed
US-6197475-B1 FILM PROPERTY, HEAT-RESISTANCE, ADHESIVITY AND IMAGE-FORMABILITY WHICH DOES NOT REQUIRE COMPLEX STEPS FOR PREPARATION AND DOES NOT CAUSE CONTAMINATION WITH CHLORIDES HITACHI CHEMICAL CO., LTD. (JP) 2001-03-06 US disclosed
EP-0622682-B1 Photosensitive resin composition HITACHI CHEMICAL CO LTD (JP) 1998-03-04 EP disclosed
EP-0633502-A1 PATTERN FORMING MATERIAL HOECHST JAPAN LIMITED (JP) 1995-01-11 EP disclosed
EP-0622682-A1 Photosensitive resin composition HITACHI CHEMICAL CO., LTD. (JP) 1994-11-02 EP disclosed