SCHEMBL2203833

SCHEMBL2203833

C(OCC1CO1)C1CO1.CCC(C)(CCC(C)C)C(=O)O

nearest known ligand 0.39

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.39
MAPK1 P28482 1/20 0.39
ALDH1A1 P00352 4/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
TDP1 Q9NUW8 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2850663 0.82 ALDH1A1 (0.40) TSHRMAPK1ALDH1A1
SCHEMBL37688 0.80 TSHR (0.39) TSHRALDH1A1
SCHEMBL19177138 0.78 CYP2D6 (0.38) TSHRALDH1A1
SCHEMBL21402676 0.78 CYP2D6 (0.38) TSHRALDH1A1
SCHEMBL7147409 0.78 CYP2D6 (0.38) TSHRALDH1A1
SCHEMBL23175300 0.78 CYP2D6 (0.38) TSHRALDH1A1
SCHEMBL1452917 0.78 CYP2D6 (0.38) TSHRALDH1A1
SCHEMBL1938911 0.78 CYP2D6 (0.38) TSHRALDH1A1
SCHEMBL17911359 0.78 CYP2D6 (0.38) TSHRALDH1A1
Hydrochloric Acid SCHEMBL4619800 0.78 CYP2D6 (0.38) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116333563-B Crystal brick waterproof composition 福建三青涂料有限公司 2024-01-26 CN claimed
CN-117402500-A Thermosetting composite modified asphalt suitable for emergency repair 朱吉鹏 2024-01-16 CN claimed
CN-116333563-A Crystal brick waterproof composition 福建三青涂料有限公司 2023-06-27 CN claimed
WO-2023082230-A1 POLYMER ALLOY, PREPARATION METHOD THEREFOR, AND USE THEREOF 青岛科技大学 2023-05-19 WO claimed
CN-112408861-B Environment-friendly normal-temperature thermosetting modified adhesive material for quick repair 南京励米青新材料科技有限公司 2022-12-13 CN claimed
CN-114044985-A Modified nano-silicon fiber reinforced mold cleaning adhesive for semiconductor packaging mold 江苏海洋大学 2022-02-15 CN claimed
CN-109971315-B Automobile paint surface repairing paint and repairing process thereof 广州市车极速汽车服务有限责任公司 2021-04-27 CN claimed
CN-112408861-A Environment-friendly normal-temperature thermosetting modified adhesive material for quick repair 南京励米青新材料科技有限公司 2021-02-26 CN claimed
CN-110982289-A Normal-temperature thermosetting modified asphalt material 南京励米青新材料科技有限公司 2020-04-10 CN claimed
EP-2948506-B1 UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME Henkel IP & Holding GmbH (DE) 2019-08-14 EP claimed
US-9688892-B2 Underfill composition and packaging process using the same HENKEL AG & CO. KGAA (DE) 2017-06-27 US claimed
EP-2948506-A1 UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME Henkel IP & Holding GmbH (DE) 2015-12-02 EP claimed
US-20150322309-A1 UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME HENKEL AG & CO. KGAA (DE) 2015-11-12 US claimed
WO-2014113931-A1 UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME Henkel IP & Holding GmbH (DE) 2014-07-31 WO claimed
US-8450433-B2 Resin composition for manufacturing marble chips, method for manufacturing marble chips, and artificial marble made from marble chips KIM YOUNG-MIN (KR) 2013-05-28 US claimed
CN-102066448-B Coating compositions comprising polyurea and a phosphorus-containing polyol PPG IND OHIO INC 2013-04-03 CN claimed
CN-102066448-A Coating compositions comprising polyurea and a phosphorus-containing polyol PPG IND OHIO INC 2011-05-18 CN claimed
US-20100311867-A1 Resin Composition for Manufacturing Marble Chips, Method for Manufacturing Marble Chips, and Artificial Marble Made From Marble Chips KIM YOUNG-MIN 2010-12-09 US claimed
EP-2248856-A2 RESIN COMPOSITION FOR MANUFACTURING MARBLE CHIPS, METHOD FOR MANUFACTURING MARBLE CHIPS USING THE SAME, AND ARTIFICIAL MARBLE MADE FROM MARBLE CHIPS Kim, Young-Min (KR) 2010-11-10 EP claimed
CN-116333563-B Crystal brick waterproof composition 福建三青涂料有限公司 2024-01-26 CN disclosed
CN-117417641-A Asphalt composition, asphalt mixture, preparation method and application thereof 余秋琼 2024-01-19 CN disclosed
CN-117402500-A Thermosetting composite modified asphalt suitable for emergency repair 朱吉鹏 2024-01-16 CN disclosed
CN-116333563-A Crystal brick waterproof composition 福建三青涂料有限公司 2023-06-27 CN disclosed
WO-2023082230-A1 POLYMER ALLOY, PREPARATION METHOD THEREFOR, AND USE THEREOF 青岛科技大学 2023-05-19 WO disclosed
US-20230069918-A1 TUNABLE DEGRADATION OF ESTER-BASED EPOXY FORMULATIONS RES TRIANGLE INST (US) 2023-03-09 US disclosed
CN-112368349-B Adhesive composition, preparation method thereof, adhesive sheet body containing adhesive composition and product CJ第一制糖株式会社 2023-01-10 CN disclosed
CN-112334556-B Adhesive composition, preparation method thereof and adhesive product containing same CJ第一制糖株式会社 2022-12-13 CN disclosed
CN-112313300-B Adhesive composition, method for preparing the same and adhesive product comprising the same CJ第一制糖株式会社 2022-12-13 CN disclosed
CN-112408861-B Environment-friendly normal-temperature thermosetting modified adhesive material for quick repair 南京励米青新材料科技有限公司 2022-12-13 CN disclosed
CN-112334555-B Adhesive composition, preparation method thereof and adhesive product containing adhesive composition CJ第一制糖株式会社 2022-12-13 CN disclosed
EP-4097162-A2 TUNABLE DEGRADATION OF ESTER-BASED EPOXY FORMULATIONS Research Triangle Institute (US) 2022-12-07 EP disclosed
CN-112334557-B Adhesive composition, method for preparing the same and adhesive product comprising the same CJ第一制糖株式会社 2022-11-29 CN disclosed
CN-112334564-B Method for inhibiting dust generation, soil stabilization composition, and spraying device comprising soil stabilization composition CJ第一制糖株式会社 2022-05-31 CN disclosed
CN-114316866-A Steel-bonding adhesive for building structure and preparation method thereof 深圳市凯龙建筑加固技术有限公司 2022-04-12 CN disclosed
US-11289238-B2 Compositions for the filling of high aspect ratio vertical interconnect access (VIA) holes HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN LLC (US) 2022-03-29 US disclosed
CN-114044985-A Modified nano-silicon fiber reinforced mold cleaning adhesive for semiconductor packaging mold 江苏海洋大学 2022-02-15 CN disclosed
CN-113773721-A Silver ion antibacterial floor material and preparation method thereof 浙江润奥环保科技有限公司 2021-12-10 CN disclosed
WO-2021152460-A2 TUNABLE DEGRADATION OF ESTER-BASED EPOXY FORMULATIONS RESEARCH TRIANGLE INSTITUTE (US) 2021-08-05 WO disclosed
WO-2021112933-A1 COMPOSITIONS FOR THE FILLING OF HIGH ASPECT RATIO VERTICAL INTERCONNECT ACCESS (VIA) HOLES HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN LLC (US) 2021-06-10 WO disclosed
US-20210174983-A1 COMPOSITIONS FOR THE FILLING OF HIGH ASPECT RATIO VERTICAL INTERCONNECT ACCESS (VIA) HOLES HERAEUS PRECIOUS METALS NORTH AMERICA CONSHOHOCKEN LLC 2021-06-10 US disclosed
CN-109971315-B Automobile paint surface repairing paint and repairing process thereof 广州市车极速汽车服务有限责任公司 2021-04-27 CN disclosed
CN-112409836-A Photocatalytic antibacterial coating and preparation device thereof 常州山由帝杉防护材料制造有限公司 2021-02-26 CN disclosed
CN-112408861-A Environment-friendly normal-temperature thermosetting modified adhesive material for quick repair 南京励米青新材料科技有限公司 2021-02-26 CN disclosed
CN-112368349-A Adhesive composition for label, method for preparing the same, adhesive sheet comprising the same, and object comprising the adhesive sheet CJ第一制糖株式会社 2021-02-12 CN disclosed
CN-112334557-A Adhesive composition and method for preparing the same CJ第一制糖株式会社 2021-02-05 CN disclosed
CN-112334556-A Adhesive composition and method for preparing the same CJ第一制糖株式会社 2021-02-05 CN disclosed
CN-112334555-A Adhesive composition and method for preparing the same CJ第一制糖株式会社 2021-02-05 CN disclosed
CN-112313300-A Adhesive composition and method for preparing the same CJ第一制糖株式会社 2021-02-02 CN disclosed
EP-3356455-B1 HIGH PERFORMANCE COATINGS RESINATE MAT GROUP INC (US) 2020-12-09 EP disclosed
CN-108966655-B Adhesive composition, method for producing the same, and adhesive product CJ第一制糖株式会社 2020-08-18 CN disclosed
US-10745585-B2 High performance coatings RESINATE MATERIALS GROUP, INC. (US) 2020-08-18 US disclosed
CN-108966654-B Adhesive composition, method for producing the same, and adhesive product CJ第一制糖株式会社 2020-05-19 CN disclosed
CN-110982289-A Normal-temperature thermosetting modified asphalt material 南京励米青新材料科技有限公司 2020-04-10 CN disclosed
WO-2020046060-A1 ADHESIVE COMPOSITION AND PREPARATION METHOD THEREOF 씨제이제일제당(주) 2020-03-05 WO disclosed
WO-2020046055-A1 ADHESIVE COMPOSITION, AND METHOD FOR PREPARING SAME 씨제이제일제당(주) 2020-03-05 WO disclosed
WO-2020046061-A1 ADHESIVE COMPOSITION AND PREPARATION METHOD THEREFOR 씨제이제일제당(주) 2020-03-05 WO disclosed
WO-2020046058-A1 ADHESIVE COMPOSITION, AND PRODUCTION METHOD THEREOF 씨제이제일제당(주) 2020-03-05 WO disclosed
EP-2948506-B1 UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME Henkel IP & Holding GmbH (DE) 2019-08-14 EP disclosed
EP-3356455-A1 HIGH PERFORMANCE COATINGS Resinate Materials Group, Inc. (US) 2018-08-08 EP disclosed
US-9688892-B2 Underfill composition and packaging process using the same HENKEL AG & CO. KGAA (DE) 2017-06-27 US disclosed
US-20170096581-A1 HIGH PERFORMANCE COATINGS RESINATE MATERIALS GROUP, INC. 2017-04-06 US disclosed
EP-2948506-A1 UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME Henkel IP & Holding GmbH (DE) 2015-12-02 EP disclosed
US-20150322309-A1 UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME HENKEL AG & CO. KGAA (DE) 2015-11-12 US disclosed
EP-2152437-B1 RADIATION CURABLE INKS COLLINS INK CORP (US) 2014-11-26 EP disclosed
WO-2014113931-A1 UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME Henkel IP & Holding GmbH (DE) 2014-07-31 WO disclosed
US-20140179890-A1 USE OF EPOXIDISED ARYL ALKYL PHENOLS AS REACTIVE RESIN DILUENTS MOMENTIVE SPECIALTY CHEMICALS GMBH (DE) 2014-06-26 US disclosed
US-8450433-B2 Resin composition for manufacturing marble chips, method for manufacturing marble chips, and artificial marble made from marble chips KIM YOUNG-MIN (KR) 2013-05-28 US disclosed
CN-102066448-B Coating compositions comprising polyurea and a phosphorus-containing polyol PPG IND OHIO INC 2013-04-03 CN disclosed
US-7977402-B2 Photocation polymerization initiator, a free-radical photoinitiator; an acrylate ester of a carboxylic acid ester; and material containing a radiation curable functional group; imppulse printheads COLLINS INK CORPORATION (US) 2011-07-12 US disclosed
CN-102066448-A Coating compositions comprising polyurea and a phosphorus-containing polyol PPG IND OHIO INC 2011-05-18 CN disclosed
US-20100311867-A1 Resin Composition for Manufacturing Marble Chips, Method for Manufacturing Marble Chips, and Artificial Marble Made From Marble Chips KIM YOUNG-MIN 2010-12-09 US disclosed
EP-2248856-A2 RESIN COMPOSITION FOR MANUFACTURING MARBLE CHIPS, METHOD FOR MANUFACTURING MARBLE CHIPS USING THE SAME, AND ARTIFICIAL MARBLE MADE FROM MARBLE CHIPS Kim, Young-Min (KR) 2010-11-10 EP disclosed
EP-2152437-A1 RADIATION CURABLE INKS Collins Ink Corporation (US) 2010-02-17 EP disclosed
WO-2008045478-A1 RADIATION CURABLE INKJETTABLE ADHESIVE HEXION SPECIALTY CHEMICALS, INC. (US) 2008-04-17 WO disclosed
WO-2008045478-A1 RADIATION CURABLE INKJETTABLE ADHESIVE HEXION SPECIALTY CHEMICALS, INC. (US) 2008-04-17 WO disclosed
WO-2008045480-A1 RADIATION CURABLE INKS HEXION SPECIALTY CHEMICALS, INC. (US) 2008-04-17 WO disclosed
US-20080090930-A1 Photocation polymerization initiator, a free-radical photoinitiator; an acrylate ester of a carboxylic acid ester; and material containing a radiation curable functional group; imppulse printheads HEXION SPECIALTY CHEMICALS, INC. 2008-04-17 US disclosed
US-20080090932-A1 Radiation curable inkjettable adhesive HEXION SPECIALTY CHEMICALS, INC. 2008-04-17 US disclosed