SCHEMBL2207653

SCHEMBL2207653

C=Cc1ccc([SiH2]OC)cc1

nearest known ligand 0.50

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.50
TSHR P16473 1/20 0.39
TRPA1 O75762 1/20 0.38
HDAC8 Q9BY41 1/20 0.38
CHRNB2 P17787 1/20 0.38
CHRNB4 P30926 1/20 0.38
CHRNA3 P32297 1/20 0.38
CHRNA7 P36544 1/20 0.38
CHRNA4 P43681 1/20 0.38
TDP1 Q9NUW8 2/20 0.34
TP53 P04637 1/20 0.31
TAS1R3 Q7RTX0 1/20 0.31
TAS1R1 Q7RTX1 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8760384 0.78 ALDH1A1 (0.46) ALDH1A1TSHRTRPA1HDAC8CHRNB2
SCHEMBL5705008 0.77 ALDH1A1 (0.50) ALDH1A1TSHRTRPA1HDAC8CHRNB2
SCHEMBL23493418 0.77 ALDH1A1 (0.44) ALDH1A1TSHRTRPA1HDAC8CHRNB2
SCHEMBL21251160 0.77 ALDH1A1 (0.44) ALDH1A1TSHRTRPA1HDAC8CHRNB2
SCHEMBL10530393 0.74 ALDH1A1 (0.46) ALDH1A1TSHRTRPA1HDAC8CHRNB2
SCHEMBL15483427 0.74 ALDH1A1 (0.41) ALDH1A1TSHRTRPA1HDAC8CHRNB2
SCHEMBL21409798 0.74 CHRNB2 (0.44) ALDH1A1TSHRTRPA1HDAC8CHRNB2
SCHEMBL28681940 0.74 ALDH1A1 (0.41) ALDH1A1TSHRTRPA1HDAC8CHRNB2
SCHEMBL8165840 0.73 ALDH1A1 (0.58) ALDH1A1TSHRTRPA1HDAC8CHRNB2
Styrene SCHEMBL10581594 0.73 ALDH1A1 (0.64) ALDH1A1TSHRTRPA1HDAC8TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11883790-B2 Hollow particles, method for producing same, and usage of same SEKISUI KASEI CO., LTD. (JP) 2024-01-30 US claimed
EP-3766571-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING SAME, AND USAGE OF SAME SEKISUI KASEI CO., LTD. (JP) 2021-01-20 EP claimed
US-20210001300-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING SAME, AND USAGE OF SAME SEKISUI KASEI CO., LTD. (JP) 2021-01-07 US claimed
EP-3162434-B1 HOLLOW PARTICLES SEKISUI PLASTICS (JP) 2020-02-26 EP claimed
US-10550280-B2 Hollow particles, method for producing same, use thereof, and method for producing microcapsule particles SEKISUI PLASTICS CO., LTD. (JP) 2020-02-04 US claimed
WO-2019177006-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING SAME, AND USAGE OF SAME 積水化成品工業株式会社 2019-09-19 WO claimed
EP-3162434-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING SAME, USE THEREOF, AND METHOD FOR PRODUCING MICROCAPSULE PARTICLES Sekisui Plastics Co., Ltd. (JP) 2017-05-03 EP claimed
US-20170114243-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING SAME, USE THEREOF, AND METHOD FOR PRODUCING MICROCAPSULE PARTICLES SEKISUI PLASTICS CO., LTD. (JP) 2017-04-27 US claimed
WO-2024116861-A1 CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED ARTICLE DIC株式会社 2024-06-06 WO disclosed
US-11883790-B2 Hollow particles, method for producing same, and usage of same SEKISUI KASEI CO., LTD. (JP) 2024-01-30 US disclosed
EP-3434707-B1 HOLLOW PARTICLES AND USE OF SAME SEKISUI PLASTICS (JP) 2023-12-27 EP disclosed
WO-2023199972-A1 DISPERSION, STRUCTURE, AND STRUCTURE MANUFACTURING METHOD 三菱ケミカル株式会社 2023-10-19 WO disclosed
CN-116783550-A Solder resist composition, dry film, printed wiring board and method for manufacturing the same 韩国太阳油墨有限公司 2023-09-19 CN disclosed
US-11369935-B2 Hollow particles and use thereof SEKISUI PLASTICS CO., LTD. (JP) 2022-06-28 US disclosed
EP-2599621-B1 GAS BARRIER FILM, PROCESS FOR PRODUCTION OF GAS BARRIER FILM, AND ELECTRONIC DEVICE KONICA MINOLTA HOLDINGS INC (JP) 2016-03-02 EP disclosed
EP-2599621-A1 GAS BARRIER FILM, PROCESS FOR PRODUCTION OF GAS BARRIER FILM, AND ELECTRONIC DEVICE Konica Minolta Holdings, Inc. (JP) 2013-06-05 EP disclosed
US-20130115423-A1 GAS BARRIER FILM, PROCESS FOR PRODUCTION OF GAS BARRIER FILM, AND ELECTRONIC DEVICE KONICA MINOLTA HOLDINGS, INC. (JP) 2013-05-09 US disclosed
US-7981511-B2 Hollow resin fine particles, organic/inorganic hybrid fine particles, and method for producing hollow resin fine particles SEKISUI CHEMICAL CO., LTD. (JP) 2011-07-19 US disclosed
US-20070251422-A1 Hollow Resin Fine Particles, Organic/Inorganic Hybrid Fine Particles, and Method for Producing Hollow Resin Fine Particles SEKISUI CHEMICAL CO., LTD. (JP) 2007-11-01 US disclosed
EP-1739116-A1 HOLLOW RESIN FINE PARTICLES, ORGANIC/INORGANIC HYBRID FINE PARTICLES, AND METHOD FOR PRODUCING HOLLOW RESIN FINE ARTICLES SEKISUI CHEMICAL CO., LTD. (JP) 2007-01-03 EP disclosed