Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ESR1 | P03372 | 11/20 | 0.58 |
| ▸ | ESR2 | Q92731 | 11/20 | 0.58 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.46 |
| ▸ | NR1I2 | O75469 | 2/20 | 0.42 |
| ▸ | LMNA | P02545 | 2/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.40 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.40 |
| ▸ | MIF | P14174 | 1/20 | 0.40 |
| ▸ | TYR | P14679 | 1/20 | 0.40 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.40 |
| ▸ | HTT | P42858 | 1/20 | 0.40 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.40 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.40 |
| ▸ | MAOB | P27338 | 1/20 | 0.40 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.39 |
| ▸ | TLR8 | Q9NR97 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29771841 | 1.00 | ESR1 (0.58) | ESR1ESR2MCL1NR1I2LMNA | |
| SCHEMBL1206773 | 0.84 | ESR1 (0.72) | ESR1ESR2CYP2C9CYP1A2TLR8 | |
| SCHEMBL3959261 | 0.82 | TRPA1 (0.52) | ESR1ESR2LMNAALDH1A1ALOX15 | |
| Betanaphthol SCHEMBL17506723 | 0.81 | CYP1A2 (0.61) | ESR1ESR2MCL1LMNACYP2C9 | |
| SCHEMBL12341939 | 0.78 | CTDSP1 (0.57) | ESR1ESR2LMNAALDH1A1CYP2C9 | |
| SCHEMBL20306775 | 0.77 | ESR2 (0.42) | ESR1ESR2ALDH1A1HTTHSD17B10 | |
| SCHEMBL670670 | 0.77 | CYP1A2 (0.52) | ESR1ESR2MCL1LMNAALDH1A1 | |
| SCHEMBL29848183 | 0.76 | ESR1 (0.44) | ESR1ESR2MCL1LMNACYP2C9 | |
| SCHEMBL3212292 | 0.76 | PTPN22 (0.56) | ESR1ESR2MCL1LMNAALOX15 | |
| SCHEMBL12251173 | 0.76 | ESR1 (0.44) | ESR1ESR2MCL1LMNACYP2C9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240270891-A1 | PHENOLIC HYDROXY GROUP-CONTAINING RESIN, RESIN COMPOSITION FOR ALKALINE DEVELOPABLE RESIST, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING PHENOLIC HYDROXY GROUP-CONTAINING RESIN | DIC CORPORATION (JP) | 2024-08-15 | — | — | US | disclosed |
| CN-116209690-A | Phenolic hydroxyl group-containing resin, resin composition for alkali-developable resist, resist-curable resin composition, and method for producing phenolic hydroxyl group-containing resin | DIC株式会社 | 2023-06-02 | — | — | CN | disclosed |
| CN-115873214-A | Epoxy resin, photosensitive resin composition, resist film, curable composition, and cured film | DIC株式会社 | 2023-03-31 | — | — | CN | disclosed |
| EP-3854848-B1 | RESIN COMPOSITION, CURED OBJECT, AND LAMINATE | DAINIPPON INK & CHEMICALS (JP) | 2023-01-25 | — | — | EP | disclosed |
| CN-109960111-B | Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, and method for forming pattern | 信越化学工业株式会社 | 2022-07-12 | — | — | CN | disclosed |
| EP-3362518-B1 | SENSOR DYES FOR REAL-TIME SENSING OF METAL IONS IN AQUEOUS ENVIRONMENTS | THE UWM RES FOUNDATION INC (US) | 2022-04-27 | — | — | EP | disclosed |
| WO-2022065041-A1 | RESIN CONTAINING PHENOLIC HYDROXYL GROUP, RESIN COMPOSITION FOR ALKALI-DEVELOPABLE RESISTS, RESIST CURABLE RESIN COMPOSITION, AND METHOD FOR PRODUCING RESIN CONTAINING PHENOLIC HYDROXYL GROUP | DIC株式会社 | 2022-03-31 | — | — | WO | disclosed |
| US-11018015-B2 | Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-05-25 | — | — | US | disclosed |
| EP-3508918-B1 | COMPOSITION FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS | SHINETSU CHEMICAL CO (JP) | 2020-07-15 | — | — | EP | disclosed |
| WO-2020053196-A1 | METHOD FOR THE BIOCATALYTIC ALKYLATION OF A SUBSTRATE | UNIVERSITÄT BASEL (CH) | 2020-03-19 | — | — | WO | disclosed |
| US-20160018735-A1 | COMPOUND FOR FORMING ORGANIC FILM, AND ORGANIC FILM COMPOSITION USING THE SAME, PROCESS FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS | SHINETSU CHEMICAL CO (JP) | 2016-01-21 | — | — | US | disclosed |
| CN-104768978-A | Photopolymerizable resin composition for molding, and molded multilayer article | DAINIPPON INK & CHEMICALS | 2015-07-08 | — | — | CN | disclosed |
| EP-2343327-B1 | CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD, AND EPOXY RESIN AND METHOD FOR PRODUCING SAME | DAINIPPON INK & CHEMICALS (JP) | 2013-07-24 | — | — | EP | disclosed |
| CN-102186898-B | Curable resin composition and cured product thereof, printed circuit board, and epoxy resin and method for producing same | DAINIPPON INK & CHEMICALS | 2013-03-13 | — | — | CN | disclosed |
| US-8168731-B2 | Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same | DIC CORPORATION (JP) | 2012-05-01 | — | — | US | disclosed |
| CN-101213490-B | Photosensitive resin composition | DAINIPPON INK & CHEMICALS | 2011-11-02 | — | — | CN | disclosed |
| US-20110259628-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED WIRING BOARD, EPOXY RESIN, AND PROCESS FOR PRODUCING THE SAME | DIC CORPORATION (JP) | 2011-10-27 | — | — | US | disclosed |
| CN-102186898-A | Curable resin composition and cured product thereof, printed circuit board, and epoxy resin and method for producing same | DAINIPPON INK & CHEMICALS | 2011-09-14 | — | — | CN | disclosed |
| EP-2343327-A1 | CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD, AND EPOXY RESIN AND METHOD FOR PRODUCING SAME | DIC Corporation (JP) | 2011-07-13 | — | — | EP | disclosed |
| CN-101213490-A | Photosensitive resin composition | DAINIPPON INK & CHEMICALS (JP) | 2008-07-02 | — | — | CN | disclosed |