SCHEMBL22097547

SCHEMBL22097547

O=C(NS(=O)(=O)c1c(F)c(F)c(O)c(F)c1F)c1c(I)ccc(I)c1O

nearest known ligand 0.36

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
▸ HDAC6 Q9UBN7 1/20 0.36
▸ CA1 P00915 6/20 0.33
▸ CA2 P00918 6/20 0.33
▸ MMP1 P03956 1/20 0.33
▸ MMP2 P08253 1/20 0.33
▸ MMP9 P14780 1/20 0.33
▸ MMP8 P22894 1/20 0.33
▸ MMP13 P45452 1/20 0.33
▸ HPGD P15428 1/20 0.31
▸ PTGS2 P35354 2/20 0.30
▸ PTGS1 P23219 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22097545 0.90 HDAC6 (0.35) HDAC6CA1CA2MMP1MMP2
SCHEMBL26343810 0.74 TTR (0.35) HDAC6CA1CA2MMP1MMP2
SCHEMBL22097550 0.74 MAPK1 (0.34) CA1CA2
SCHEMBL26343807 0.73 HDAC6 (0.35) HDAC6CA1CA2MMP1MMP2
SCHEMBL13590940 0.71 CA1 (0.52) HDAC6CA1CA2MMP1MMP2
SCHEMBL22097591 0.65 HDAC6 (0.37) HDAC6CA1CA2MMP1MMP2
SCHEMBL21783789 0.61 DPP4 (0.43) CA1CA2HPGD
SCHEMBL26343837 0.61 CA1 (0.39) HDAC6CA1CA2MMP1MMP2
SCHEMBL23388546 0.60 HDAC6 (0.64) HDAC6CA1CA2MMP1MMP2
SCHEMBL30150622 0.60 HDAC6 (0.64) HDAC6CA1CA2MMP1MMP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11774853-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-03 — — US disclosed
US-11774853-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-03 — — US disclosed
US-20200192222-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-06-18 — — US disclosed
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