SCHEMBL2213752

SCHEMBL2213752

CCN(CN(CC)c1ccccc1)c1ccccc1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.64
CNR2 P34972 1/20 0.52
TAAR1 Q96RJ0 5/20 0.47
MEN1 O00255 3/20 0.47
KMT2A Q03164 3/20 0.47
RAB9A P51151 2/20 0.47
NPC1 O15118 1/20 0.47
NOX1 Q9Y5S8 1/20 0.47
ALDH1A1 P00352 4/20 0.46
GLA P06280 1/20 0.46
CYP3A4 P08684 2/20 0.46
PSMD14 O00487 1/20 0.46
MAPK1 P28482 1/20 0.46
RECQL P46063 1/20 0.46
GFER P55789 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46
MAPT P10636 1/20 0.46
ALDH3A1 P30838 1/20 0.43
ALDH1A3 P47895 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Diethylaniline SCHEMBL9000098 0.89 TSHR (0.70) TSHRCNR2TAAR1MEN1KMT2A
Diethylaniline SCHEMBL17594 0.89 TSHR (0.70) TSHRCNR2TAAR1MEN1KMT2A
Diethylaniline SCHEMBL29597320 0.86 TSHR (0.67) TSHRCNR2TAAR1MEN1KMT2A
Diethylaniline SCHEMBL31229134 0.86 TSHR (0.67) TSHRCNR2TAAR1MEN1KMT2A
Diethylaniline SCHEMBL30768306 0.86 TSHR (0.67) TSHRCNR2TAAR1MEN1KMT2A
Diethylaniline SCHEMBL9638069 0.86 TSHR (0.67) TSHRCNR2TAAR1MEN1KMT2A
Diethylaniline SCHEMBL184484 0.86 TSHR (0.67) TSHRCNR2TAAR1MEN1KMT2A
Diethylaniline SCHEMBL30880867 0.86 TSHR (0.67) TSHRCNR2TAAR1MEN1KMT2A
Diethylaniline SCHEMBL1920410 0.86 TSHR (0.67) TSHRCNR2TAAR1MEN1KMT2A
Diethylaniline SCHEMBL2215318 0.86 TSHR (0.67) TSHRCNR2TAAR1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120051356-A Chemical mechanical polishing pad with disulfide bonds CMC材料有限责任公司 2025-05-27 CN disclosed
CN-118139742-A Resin-coated metal foil, printed wiring board, method for manufacturing the same, and semiconductor package 株式会社力森诺科 2024-06-04 CN disclosed
US-11827789-B2 Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof RESONAC CORPORATION (JP) 2023-11-28 US disclosed
CN-117043217-A Epoxy resin composition, prepreg and fiber-reinforced composite material 东丽株式会社 2023-11-10 CN disclosed
WO-2023074646-A1 RESIN-COATED METAL FOIL, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE 株式会社レゾナック 2023-05-04 WO disclosed
US-11553593-B2 Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board SHOWA DENKO MATERIALS CO., LTD. (JP) 2023-01-10 US disclosed
CN-114729109-A Epoxy resin composition, prepreg, and fiber-reinforced composite material 东丽株式会社 2022-07-08 CN disclosed
CN-114729106-A Epoxy resin composition, prepreg, and fiber-reinforced composite material 东丽株式会社 2022-07-08 CN disclosed
CN-114729108-A Epoxy resin composition, prepreg, and fiber-reinforced composite material 东丽株式会社 2022-07-08 CN disclosed
CN-114729107-A Epoxy resin composition, prepreg, and fiber-reinforced composite material 东丽株式会社 2022-07-08 CN disclosed
US-20120305291-A1 PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-12-06 US disclosed
US-20120178332-A1 Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2012-07-12 US disclosed
EP-1876873-B1 PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD NIPPON KAYAKU KK (JP) 2011-07-27 EP disclosed
US-20100172825-A1 Molecular Hydrogen Stores and Hydrogen Transfer Reagents for Hydrogenation Reactions UNIVERSITAT HEIDELBERG (DE) 2010-07-08 US disclosed
US-7517553-B2 Adhesive aid composition NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2009-04-14 US disclosed
US-20090056982-A1 Process for producing a double-sided flexible printed board and double-sided flexible printed board NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2009-03-05 US disclosed
EP-1876873-A1 PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD Nippon Kayaku Kabushiki Kaisha (JP) 2008-01-09 EP disclosed
US-20070026227-A1 Adhesive aid composition NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2007-02-01 US disclosed
EP-1666556-A1 ADHESIVE AID COMPOSITION Nippon Kayaku Kabushiki Kaisha (JP) 2006-06-07 EP disclosed
EP-1667501-A1 SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME UNITIKA LTD. (JP) 2006-06-07 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100172825-A1 Molecular Hydrogen Stores and Hydrogen Transfer Reagents for Hydrogenation Reactions HVCN1, HHAT, HDHD5 TSHR 1514/4885CNR2 4024/4885TAAR1 2165/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.