Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA4 | P22748 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 3/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.36 |
| ▸ | HTT | P42858 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.35 |
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
| ▸ | GLA | P06280 | 1/20 | 0.35 |
| ▸ | MTNR1A | P48039 | 2/20 | 0.34 |
| ▸ | MTNR1B | P49286 | 2/20 | 0.34 |
| ▸ | CHKA | P35790 | 2/20 | 0.34 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.32 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.32 |
| ▸ | CA12 | O43570 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1257089 | 0.83 | TSHR (0.43) | CA4MEN1KMT2AHTTALDH1A1 | |
| SCHEMBL7482314 | 0.81 | ALDH1A1 (0.33) | CA4MEN1KMT2AHTTALDH1A1 | |
| SCHEMBL9288040 | 0.79 | TP53 (0.40) | ALDH1A1TSHRGLAMTNR1AMTNR1B | |
| SCHEMBL9853509 | 0.79 | TSHR (0.50) | MEN1KMT2AHTTALDH1A1TSHR | |
| SCHEMBL7626883 | 0.78 | KDM4E (0.42) | MEN1KMT2AALDH1A1TSHRGLA | |
| SCHEMBL7994638 | 0.78 | CARM1 (0.42) | MEN1KMT2AMTNR1AMTNR1BSMN1; SMN2 | |
| SCHEMBL9132125 | 0.78 | KMT2A (0.43) | MEN1KMT2AHTTALDH1A1MTNR1A | |
| SCHEMBL2211961 | 0.76 | ALDH1A1 (0.38) | MEN1KMT2AHTTALDH1A1TSHR | |
| SCHEMBL11177653 | 0.76 | TSHR (0.42) | MEN1KMT2AALDH1A1TSHRMTNR1A | |
| SCHEMBL7921601 | 0.76 | TAAR1 (0.52) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118139742-A | Resin-coated metal foil, printed wiring board, method for manufacturing the same, and semiconductor package | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| US-11827789-B2 | Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof | RESONAC CORPORATION (JP) | 2023-11-28 | — | — | US | disclosed |
| WO-2023074646-A1 | RESIN-COATED METAL FOIL, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2023-05-04 | — | — | WO | disclosed |
| US-11553593-B2 | Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2023-01-10 | — | — | US | disclosed |
| US-11331888-B2 | Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-05-17 | — | — | US | disclosed |
| CN-109565931-B | Composite film for electronic device using high-frequency band signal, printed wiring board, and method for manufacturing the same | 昭和电工材料株式会社 | 2022-04-29 | — | — | CN | disclosed |
| CN-109476924-B | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same | 昭和电工材料株式会社 | 2022-02-18 | — | — | CN | disclosed |
| US-20210235582-A1 | RESIN FILM FOR INTERLAYER INSULATING LAYER WITH SUPPORT, MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD | RESONAC CORPORATION (JP) | 2021-07-29 | — | — | US | disclosed |
| US-11049825-B2 | Method for producing semiconductor device | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-06-29 | — | — | US | disclosed |
| US-20200194391-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2020-06-18 | — | — | US | disclosed |
| US-20120178332-A1 | Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2012-07-12 | — | — | US | disclosed |
| EP-1876873-B1 | PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD | NIPPON KAYAKU KK (JP) | 2011-07-27 | — | — | EP | disclosed |
| US-7517553-B2 | Adhesive aid composition | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2009-04-14 | — | — | US | disclosed |
| US-20090056982-A1 | Process for producing a double-sided flexible printed board and double-sided flexible printed board | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2009-03-05 | — | — | US | disclosed |
| US-7384683-B2 | Substrate for flexible printed wiring board and method for manufacturing the same | UNITIKA LTD. (JP) | 2008-06-10 | — | — | US | disclosed |
| EP-1876873-A1 | PROCESS FOR PRODUCING DOUBLE-SIDED FLEXIBLE PRINTED BOARD AND DOUBLE-SIDED FLEXIBLE PRINTED BOARD | Nippon Kayaku Kabushiki Kaisha (JP) | 2008-01-09 | — | — | EP | disclosed |
| US-20070071984-A1 | Substrate for flexible printed wiring board and method for manufacturing the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2007-03-29 | — | — | US | disclosed |
| US-20070026227-A1 | Adhesive aid composition | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2007-02-01 | — | — | US | disclosed |
| EP-1666556-A1 | ADHESIVE AID COMPOSITION | Nippon Kayaku Kabushiki Kaisha (JP) | 2006-06-07 | — | — | EP | disclosed |
| EP-1667501-A1 | SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME | UNITIKA LTD. (JP) | 2006-06-07 | — | — | EP | disclosed |