SCHEMBL2221607

SCHEMBL2221607

C=CC1=C(CC)C=CCC1=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7796667 0.72
Butadiene SCHEMBL4256114 0.65
Formaldehyde SCHEMBL15662280 0.64
Formaldehyde SCHEMBL16715319 0.64
SCHEMBL1920623 0.64
SCHEMBL1920625 0.64
SCHEMBL18546584 0.63
SCHEMBL8677933 0.62 TSHR (0.32)
SCHEMBL5859142 0.62
SCHEMBL2591738 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103080181-B Curable resin composition 蓝立方知识产权有限责任公司 2017-04-12 CN disclosed
EP-2516409-B1 PROCESS FOR PREPARING DIVINYLARENE DIOXIDES BLUE CUBE IP LLC (US) 2017-01-25 EP disclosed
CN-105713179-A Polyoxazolidone Resins 陶氏环球技术有限责任公司 2016-06-29 CN disclosed
CN-103221448-B Comprise the epoxy resin of adducts as toughner of DVBDO 蓝立方知识产权有限责任公司 2016-06-15 CN disclosed
CN-103649158-B Insulation preparation DOW GLOBAL TECHNOLOGIES LLC (US) 2016-04-06 CN disclosed
CN-105392781-A Process and apparatus for producing divinylarene dioxide DOW GLOBAL TECHNOLOGIES LLC 2016-03-09 CN disclosed
CN-102666633-B Polyoxazolidone resins DOW GLOBAL TECHNOLOGIES LLC (US) 2016-02-17 CN disclosed
CN-103261179-B Prepare the method for divinylarene oxide DOW GLOBAL TECHNOLOGIES LLC (US) 2016-01-20 CN disclosed
CN-102666636-B Hydroxy-functional polyester resins DOW GLOBAL TECHNOLOGIES LLC (US) 2015-11-25 CN disclosed
CN-104736592-A Toughened, curable epoxy compositions for high temperature applications DOW GLOBAL TECHNOLOGIES INC 2015-06-24 CN disclosed
CN-102666633-A Polyoxazolidone resins DOW GLOBAL TECHNOLOGIES LLC 2012-09-12 CN disclosed
CN-102666637-A Toughened epoxy resin formulations DOW GLOBAL TECHNOLOGIES LLC 2012-09-12 CN disclosed
CN-102666636-A Hydroxy-functional polyester resins DOW GLOBAL TECHNOLOGIES LLC 2012-09-12 CN disclosed
CN-102666649-A Epoxy resin composition DOW GLOBAL TECHNOLOGIES LLC 2012-09-12 CN disclosed
CN-102648229-A Adducts based on divinylarene oxides DOW GLOBAL TECHNOLOGIES LLC 2012-08-22 CN disclosed
WO-2012082482-A1 PROCESS FOR PREPARING DIVINYLARENE OXIDES DOW GLOBAL TECHNOLOGIES LLC (US) 2012-06-21 WO disclosed
CN-102272199-A Hydroxyl-functional polyethers and a preparation process therefor 2011-12-07 CN disclosed
CN-102272113-A Process for preparing divinylarene dioxides 2011-12-07 CN disclosed
CN-102163563-A Epoxy resin formulations for underfill applications DOW GLOBAL TECHNOLOGIES LLC 2011-08-24 CN disclosed
WO-2011084687-A1 PROCESS FOR PREPARING DIVINYLARENE DIOXIDES DOW GLOBAL TECHNOLOGIES INC. (US) 2011-07-14 WO disclosed