SCHEMBL22277443

SCHEMBL22277443

CC(C)(OC(=O)C1C2CC3C(OC(=O)C31)C2OC(=O)c1cc(I)cc(I)c1I)C1CCNCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26426818 0.86 — —
SCHEMBL19678512 0.80 — —
SCHEMBL25142158 0.80 — —
SCHEMBL26785380 0.79 — —
SCHEMBL24360931 0.78 — —
SCHEMBL26426957 0.77 — —
SCHEMBL26059447 0.76 — —
SCHEMBL22277799 0.75 — —
SCHEMBL22097482 0.75 NPC1 (0.31) —
SCHEMBL22277441 0.75 POLB (0.30) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11835859-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-05 — — US disclosed
US-20230129578-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-27 — — US disclosed
US-20230129578-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-27 — — US disclosed
US-20200241417-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-07-30 — — US disclosed
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