SCHEMBL22277799

SCHEMBL22277799

CC(C)(OC(=O)C1CC(OC(=O)c2cc(I)cc(I)c2I)C2CC1C(=O)O2)C1CCNCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25142337 0.79 — —
SCHEMBL26785377 0.78 — —
SCHEMBL22277441 0.77 POLB (0.30) —
SCHEMBL26426960 0.76 — —
SCHEMBL26426806 0.76 MAPT (0.30) —
SCHEMBL22277443 0.75 — —
SCHEMBL26807640 0.75 — —
SCHEMBL26426818 0.74 — —
SCHEMBL22277448 0.71 — —
SCHEMBL22277449 0.70 PLAT (0.31) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11835859-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-05 — — US disclosed
US-20230129578-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-27 — — US disclosed
US-20230129578-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-27 — — US disclosed
US-20200241417-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-07-30 — — US disclosed
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