SCHEMBL26426960

SCHEMBL26426960

O=C(OC1CC(C(=O)OC2(c3ccccc3)CCNCC2)C2CC1OC2=O)c1cc(I)cc(I)c1I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26426988 0.93 — —
SCHEMBL26426968 0.92 — —
SCHEMBL26426992 0.85 — —
SCHEMBL26426950 0.82 — —
SCHEMBL26426881 0.77 OPRM1 (0.37) —
SCHEMBL26426957 0.77 — —
SCHEMBL22277799 0.76 — —
SCHEMBL26426945 0.76 OPRM1 (0.32) —
SCHEMBL26426983 0.75 — —
SCHEMBL26426884 0.73 OPRM1 (0.34) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11835859-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-05 — — US disclosed
US-20230129578-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-27 — — US disclosed
US-20230129578-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-27 — — US disclosed
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