Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TYR | P14679 | 3/20 | 0.50 |
| ▸ | ESR1 | P03372 | 1/20 | 0.41 |
| ▸ | CES2 | O00748 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8577488 | 0.84 | TYR (0.50) | TYRESR1CES2 | |
| SCHEMBL11865275 | 0.83 | TYR (0.65) | TYR | |
| SCHEMBL17703180 | 0.83 | TYR (0.65) | TYR | |
| SCHEMBL28642768 | 0.81 | TYR (0.52) | TYRESR1CES2 | |
| SCHEMBL950881 | 0.80 | TYR (0.57) | TYR | |
| SCHEMBL31618874 | 0.80 | TYR (0.57) | TYR | |
| SCHEMBL15452247 | 0.80 | TYR (0.57) | TYR | |
| SCHEMBL9006525 | 0.77 | TYR (0.48) | TYRESR1CES2 | |
| SCHEMBL51618 | 0.77 | TYR (0.70) | TYRESR1 | |
| SCHEMBL383417 | 0.77 | LMNA (0.64) | TYR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210284788-A1 | THERMALLY CONDUCTIVE MATERIAL-FORMING COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND FILM | FUJIFILM CORPORATION (JP) | 2021-09-16 | — | — | US | disclosed |
| EP-3858885-A1 | COMPOSITION FOR FORMING HEAT CONDUCTIVE MATERIALS, HEAT CONDUCTIVE MATERIAL, HEAT CONDUCTIVE SHEET, DEVICE WITH HEAT CONDUCTIVE LAYER, AND FILM | FUJIFILM Corporation (JP) | 2021-08-04 | — | — | EP | disclosed |
| US-20200241410-A1 | CURABLE COMPOSITION FOR IMPRINTING, METHOD OF MANUFACTURING CURED PRODUCT PATTERN, METHOD OF MANUFACTURING CIRCUIT SUBSTRATE, AND CURED PRODUCT | FUJIFILM CORPORATION (JP) | 2020-07-30 | — | — | US | disclosed |