SCHEMBL222860

SCHEMBL222860

C=C1CC(=O)N(C)C1=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5837194 0.85
SCHEMBL17691526 0.79
SCHEMBL6895559 0.72
SCHEMBL9612275 0.72 GSK3A (0.32)
SCHEMBL11584389 0.72
SCHEMBL6835923 0.72 MAPT (0.35)
SCHEMBL14041510 0.72 GSK3A (0.30)
SCHEMBL28078772 0.70
SCHEMBL20734016 0.70
SCHEMBL4903716 0.70 CYP19A1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1290 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0262796-B1 Resin compositons and their manufacturing method TORAY INDUSTRIES (JP) 1993-11-03 EP claimed
US-5164440-A Blend of polyamide, layered silicate, impact improver UBE INDUSTRIES, LTD. (JP) 1992-11-17 US claimed
EP-0262796-A2 Resin compositons and their manufacturing method TORAY INDUSTRIES, INC. (JP) 1988-04-06 EP claimed
EP-4748899-A1 ADHESIVE SHEET Nitto Denko Corporation (JP) 2026-05-27 EP disclosed
US-12637595-B2 Pressure-sensitive adhesive sheet, optical member, and touch panel NITTO DENKO CORPORATION (JP) 2026-05-26 US disclosed
US-20260139163-A1 PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORP (JP) 2026-05-21 US disclosed
CN-116368199-B Pressure-sensitive adhesive sheet 日东电工株式会社 2026-05-12 CN disclosed
EP-4108732-B1 HOT-MELT PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND HOT-MELT PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORP (JP) 2026-05-06 EP disclosed
EP-4737529-A1 ADHESIVE COMPOSITION, ADHESIVE TAPE AND THE USE THEREOF, AND METHOD FOR ELECTRICALLY MODIFYING THE ADHESIVE STRENGTH OF THE ADHESIVE TAPE TESA SE (DE) 2026-05-06 EP disclosed
EP-4737530-A1 ACTIVE ENERGY RAY-CURABLE ADHESIVE COMPOSITION AND ADHESIVE SHEET Toagosei Co., Ltd. (JP) 2026-05-06 EP disclosed
US-12617985-B2 Pressure-sensitive adhesive sheet and use thereof NITTO DENKO CORPORATION (JP) 2026-05-05 US disclosed
WO-1997049387-A1 PARTICLES COMPRISING AMPHIPHILIC COPOLYMERS, HAVING A CROSS-LINKED SHELL DOMAIN AND AN INTERIOR CORE DOMAIN, USEFUL FOR PHARMACEUTICAL AND OTHER APPLICATIONS G.D. SEARLE AND CO. (US) 1997-12-31 WO disclosed
WO-1997049736-A2 PARTICLES COMPRISING AMPHIPHILIC COPOLYMERS, HAVING A CROSS-LINKED SHELL DOMAIN AND AN INTERIOR CORE DOMAIN, USEFUL FOR PHARMACEUTICAL AND OTHER APPLICATIONS G.D. SEARLE AND CO. (US) 1997-12-31 WO disclosed
EP-0352042-B1 High rigidity and impact resistance resin composition UBE INDUSTRIES (JP) 1995-03-29 EP disclosed
EP-0262796-B1 Resin compositons and their manufacturing method TORAY INDUSTRIES (JP) 1993-11-03 EP disclosed
EP-0278136-B1 THERMOPLASTIC COMPOSITION ON THE BASIS OF A COPOLYMER OF A VINYLAROMATIC COMPOUND AND A VINYLCYANIDE DSM N.V. (NL) 1993-09-29 EP disclosed
US-5164440-A Blend of polyamide, layered silicate, impact improver UBE INDUSTRIES, LTD. (JP) 1992-11-17 US disclosed
US-4923925-A BLENDS OF POLYAMIDES AND POLYOLEFINS MODIFIED WITH IMIDE, AMIDE, ANHYDRIDE AND ACID FUNCTIONAL GROUPS; MOLDABILITY, IMPACT RESISTANCE TORAY INDUSTRIES, INC. 1990-05-08 US disclosed
EP-0352042-A1 High rigidity and impact resistance resin composition UBE INDUSTRIES, LTD. (JP) 1990-01-24 EP disclosed
EP-0262796-A2 Resin compositons and their manufacturing method TORAY INDUSTRIES, INC. (JP) 1988-04-06 EP disclosed