Benzoic Acid Hydrazide

Benzoic Acid Hydrazide

SCHEMBL2231658

CCCCCCCCCC(C(=O)O)C(=O)O.NNC(=O)c1ccccc1.NNC(=O)c1ccccc1

nearest known ligand 0.56

Full drug profile on Sugi Atlas →

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 3/20 0.56
PRSS1 P07477 3/20 0.52
CTSG P08311 3/20 0.52
CTRB1 P17538 3/20 0.52
CMA1 P23946 3/20 0.52
CES2 O00748 2/20 0.46
CES1 P23141 2/20 0.46
POLB P06746 1/20 0.44
CNR2 P34972 1/20 0.44
HDAC3 O15379 3/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Benzoic Acid Hydrazide SCHEMBL1892700 1.00 NAAA (0.56) NAAAPRSS1CTSGCTRB1CMA1
Benzoic Acid Hydrazide SCHEMBL2231489 0.98 NAAA (0.54) NAAAPRSS1CTSGCTRB1CMA1
SCHEMBL5391442 0.83 NAAA (0.58) NAAAPRSS1POLB
SCHEMBL9352928 0.81 CES2 (0.51) NAAAPRSS1CTSGCTRB1CMA1
SCHEMBL9356276 0.81 CES2 (0.51) NAAAPRSS1CTSGCTRB1CMA1
SCHEMBL9352414 0.81 CES2 (0.51) NAAAPRSS1CTSGCTRB1CMA1
SCHEMBL9356264 0.81 CES2 (0.51) NAAAPRSS1CTSGCTRB1CMA1
SCHEMBL10710461 0.81 CES2 (0.51) NAAAPRSS1CTSGCTRB1CMA1
SCHEMBL8857493 0.81 CES2 (0.51) NAAAPRSS1CTSGCTRB1CMA1
SCHEMBL28274106 0.81 CES2 (0.51) NAAAPRSS1CTSGCTRB1CMA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10479889-B2 Thermoplastic resin composition, molded article made therefrom, and method of preparing the composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-11-19 US claimed
US-20160185954-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE MADE THEREFROM, AND METHOD OF PREPARING THE COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-06-30 US claimed
US-11306204-B2 Polyphenylene sulfide resin composition, method of producing same, and molded article TORAY INDUSTRIES, INC. (JP) 2022-04-19 US disclosed
US-20210179848-A1 POLYPHENYLENE SULFIDE RESIN COMPOSITION, METHOD OF PRODUCING SAME, AND MOLDED ARTICLE TORAY INDUSTRIES, INC. (JP) 2021-06-17 US disclosed
EP-3708612-A1 POLYPHENYLENE SULFIDE RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MOLDED ARTICLE Toray Industries, Inc. (JP) 2020-09-16 EP disclosed
US-10479889-B2 Thermoplastic resin composition, molded article made therefrom, and method of preparing the composition SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-11-19 US disclosed
US-20160185954-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE MADE THEREFROM, AND METHOD OF PREPARING THE COMPOSITION SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-06-30 US disclosed
US-8268918-B2 Crystalline polylactic acid resin composition and product molded/formed therefrom UNITIKA LTD. (JP) 2012-09-18 US disclosed
US-20110178211-A1 BIODEGRADABLE POLYESTER RESIN COMPOSITION AND MOLDED BODY COMPOSED OF THE SAME UNITIKA LTD. (JP) 2011-07-21 US disclosed
US-20100292381-A1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY OBTAINED BY MOLDING THE SAME UNITIKA LTD. (JP) 2010-11-18 US disclosed
EP-2251378-A1 BIODEGRADABLE POLYESTER RESIN COMPOSITION AND MOLDED BODY COMPOSED OF THE SAME UNITIKA LTD. (JP) 2010-11-17 EP disclosed
US-20100130651-A1 CRYSTALLINE POLYLACTIC ACID RESIN COMPOSITION AND PRODUCT MOLDED/FORMED THEREFROM UNITIKA LTD. (JP) 2010-05-27 US disclosed