SCHEMBL2232655

SCHEMBL2232655

C=CC=CCCC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5606250 1.00
SCHEMBL28004231 0.98 MAPT (0.43)
SCHEMBL28323505 0.91 FASN (0.42)
SCHEMBL14161541 0.87 ALDH1A1 (0.59)
SCHEMBL11000998 0.86 FASN (0.52)
SCHEMBL11001012 0.86 FASN (0.52)
SCHEMBL28713632 0.84 FASN (0.60)
SCHEMBL634762 0.84 FASN (0.60)
SCHEMBL634763 0.84 FASN (0.60)
SCHEMBL11580318 0.84 ALDH1A1 (0.52)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4689041-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM Electronic Materials U.S.A, Inc. (US) 2026-02-11 EP claimed
WO-2024206302-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2024-10-03 WO claimed
US-20240327761-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2024-10-03 US claimed
US-11603512-B2 Cleaning compositions and methods of use thereof FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2023-03-14 US claimed
EP-4121224-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM Electronic Materials U.S.A, Inc. (US) 2023-01-25 EP claimed
CN-115397572-A Cleaning compositions and methods of use thereof 富士胶片电子材料美国有限公司 2022-11-25 CN claimed
WO-2021188766-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2021-09-23 WO claimed
US-20210292685-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2021-09-23 US claimed
US-20260108600-A1 METHODS AND COMPOSITIONS RELATING TO IMPROVED IONIC LIQUID ADJUVANTS PRESIDENT AND FELLOWS OF HARVARD COLLEGE (US) 2026-04-23 US disclosed
EP-4689041-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM Electronic Materials U.S.A, Inc. (US) 2026-02-11 EP disclosed
US-20250257286-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-08-14 US disclosed
WO-2024206302-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2024-10-03 WO disclosed
US-20240327761-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2024-10-03 US disclosed
US-20240117270-A1 CLEANING COMPOSITIONS AND METHODS OF USE THEREOF FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2024-04-11 US disclosed
US-20060252961-A1 triethylammonium (4-chlorophenylsulfonyl)difluoromethanesulfonate used for acid catalysts, ion exchange membranes DAIKIN INDUSTRIES, LTD. (JP) 2006-11-09 US disclosed
CN-1220676-C Method for producing acid anhydride TOKUYAMA CORP (JP) 2005-09-28 CN disclosed
US-20040242929-A1 Process for production of acid anhydride TOKUYAMA CORPORATION (JP) 2004-12-02 US disclosed
CN-1537097-A Method for producing acid anhydride ��ʽ�����ɽ 2004-10-13 CN disclosed
EP-1413572-A1 PROCESS FOR PRODUCING ACID ANHYDRIDE Tokuyama Corporation (JP) 2004-04-28 EP disclosed
US-4131743-A Process for preparing unsaturated diesters JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1978-12-26 US disclosed