⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL397781 | 0.87 | — | — | |
| SCHEMBL18357 | 0.87 | — | — | |
| SCHEMBL2554735 | 0.87 | — | — | |
| SCHEMBL8969621 | 0.87 | — | — | |
| SCHEMBL7880376 | 0.75 | — | — | |
| Ammonia Solution, Strong SCHEMBL992198 | 0.75 | — | — | |
| SCHEMBL5025861 | 0.75 | — | — | |
| SCHEMBL5407937 | 0.75 | — | — | |
| SCHEMBL3239793 | 0.75 | — | — | |
| SCHEMBL1657682 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0151737-B1 | PROCESS FOR CONTROLLING AND MONITORING THE INCORPORATION OF A DOPING MATERIAL INTO CONDUCTIVE METALLIC LAYERS DURING THEIR MANUFACTURE | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-06-27 | — | — | EP | claimed |
| EP-0154696-B1 | CONTROL AND REGULATING PROCESS FOR THE COMPOSITION AND THICKNESS OF METALLIC CONDUCTING ALLOY LAYERS DURING PRODUCTION | SIEMENS AKTIENGESELLSCHAFT (DE) | 1987-06-03 | — | — | EP | claimed |
| EP-0035351-B1 | DEFORMABLE FLEXURE ELEMENT FOR STRAIN GAGE TRANSDUCER AND METHOD OF MANUFACTURE | GOULD INC. (US) | 1985-01-23 | — | — | EP | claimed |
| US-4414274-A | Thin film electrical resistors and process of producing the same | SIEMENS AKTIENGESELLSCHAFT (DE) | 1983-11-08 | — | — | US | claimed |
| US-4325048-A | Deformable flexure element for strain gage transducer and method of manufacture | GOULD INC. (US) | 1982-04-13 | — | — | US | claimed |
| EP-0035351-A2 | Deformable flexure element for strain gage transducer and method of manufacture | GOULD INC. (US) | 1981-09-09 | — | — | EP | claimed |
| US-7999352-B2 | Semiconductor device | RICOH COMPANY, LTD. (JP) | 2011-08-16 | — | — | US | disclosed |
| US-7550819-B2 | Metal thin-film resistance element on an insulation film | RICOH COMPANY, LTD. (JP) | 2009-06-23 | — | — | US | disclosed |
| US-7425753-B2 | Semiconductor device | RICOH COMPANY, LTD. (JP) | 2008-09-16 | — | — | US | disclosed |
| US-7358592-B2 | Semiconductor device | RICOH COMPANY, LTD. (JP) | 2008-04-15 | — | — | US | disclosed |
| US-20060065949-A1 | Semiconductor device | RICOH COMPANY, LTD. (JP) | 2006-03-30 | — | — | US | disclosed |
| US-20060027892-A1 | Semiconductor device | RICOH ELECTRONIC DEVICES CO., LTD. (JP) | 2006-02-09 | — | — | US | disclosed |
| US-20050236676-A1 | Semiconductor device | NISSHINBO MICRO DEVICES INC. (JP) | 2005-10-27 | — | — | US | disclosed |
| US-20050230833-A1 | Semiconductor device | RICOH COMPANY, LTD. (JP) | 2005-10-20 | — | — | US | disclosed |
| US-20050202219-A1 | Semiconductor device and fabrication process thereof | NISSHINBO MICRO DEVICES INC. (JP) | 2005-09-15 | — | — | US | disclosed |
| EP-0035351-B1 | DEFORMABLE FLEXURE ELEMENT FOR STRAIN GAGE TRANSDUCER AND METHOD OF MANUFACTURE | GOULD INC. (US) | 1985-01-23 | — | — | EP | disclosed |
| US-4414274-A | Thin film electrical resistors and process of producing the same | SIEMENS AKTIENGESELLSCHAFT (DE) | 1983-11-08 | — | — | US | disclosed |
| US-4414274-A | Thin film electrical resistors and process of producing the same | SIEMENS AKTIENGESELLSCHAFT (DE) | 1983-11-08 | — | — | US | disclosed |
| US-4325048-A | Deformable flexure element for strain gage transducer and method of manufacture | GOULD INC. (US) | 1982-04-13 | — | — | US | disclosed |
| EP-0035351-A2 | Deformable flexure element for strain gage transducer and method of manufacture | GOULD INC. (US) | 1981-09-09 | — | — | EP | disclosed |