⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL931781 | 0.93 | — | — | |
| SCHEMBL930966 | 0.88 | — | — | |
| SCHEMBL931201 | 0.88 | — | — | |
| SCHEMBL2240233 | 0.86 | TSHR (0.36) | — | |
| SCHEMBL3481679 | 0.86 | TSHR (0.32) | — | |
| SCHEMBL930713 | 0.83 | — | — | |
| SCHEMBL2247641 | 0.83 | — | — | |
| SCHEMBL2246451 | 0.83 | — | — | |
| SCHEMBL22661026 | 0.81 | — | — | |
| SCHEMBL5834136 | 0.80 | TSHR (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116234874-B | Curable composition | 株式会社钟化 | 2024-07-19 | — | — | CN | disclosed |
| CN-116234874-A | Curable composition | 株式会社钟化 | 2023-06-06 | — | — | CN | disclosed |
| WO-2022075386-A1 | CURABLE COMPOSITION | 株式会社カネカ | 2022-04-14 | — | — | WO | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| CN-101641767-B | Silicon dielectric treating agent for use after etching, process for producing semiconductor device, and semiconductor device | FUJITSU LTD | 2013-10-30 | — | — | CN | disclosed |
| US-7994250-B2 | Vinyl-urethane copolymers with intermediary linkage segments having silicon-oxygen bonds and production methods thereof | KONISHI CO., LTD. (JP) | 2011-08-09 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| US-20090326151-A1 | HAIR COSMETIC | KONISHI CO., LTD. (JP) | 2009-12-31 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-2039347-A1 | COSMETIC HAIR PREPARATION | Shiseido Company, Limited (JP) | 2009-03-25 | — | — | EP | disclosed |
| EP-1837360-A1 | VINYL-URETHANE COPOLYMER AND METHOD FOR PRODUCING SAME | Konishi Co., Ltd. (JP) | 2007-09-26 | — | — | EP | disclosed |
| US-20070117902-A1 | Vinyl-urethane copolymers and production methods thereof | KONISHI CO., LTD. (JP) | 2007-05-24 | — | — | US | disclosed |
| US-7005532-B2 | Process of producing alkoxysilanes | TOAGOSEI CO., LTD. (JP) | 2006-02-28 | — | — | US | disclosed |
| US-20050020845-A1 | Process of producing alkoxysilanes | TOAGOSEI CO., LTD. (JP) | 2005-01-27 | — | — | US | disclosed |
| EP-1428828-A1 | PROCESS FOR PREPARATION OF ALKOXYSILANES | TOAGOSEI CO., LTD. (JP) | 2004-06-16 | — | — | EP | disclosed |
| US-4026826-A | ALKOXYSILANES | JAPAN ATOMIC ENERGY RESEARCH INSTITUTE (JA) | 1977-05-31 | — | — | US | disclosed |