SCHEMBL224097

SCHEMBL224097

CC(C)C1=NCCN1CCO

nearest known ligand 0.40

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TOP2A P11388 1/20 0.40
TOP2B Q02880 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL535313 0.98 TOP2A (0.42) TOP2ATOP2B
Hydrochloric Acid SCHEMBL16262503 0.98 TOP2A (0.42) TOP2ATOP2B
Hydrochloric Acid SCHEMBL28347496 0.98 TOP2A (0.42) TOP2ATOP2B
SCHEMBL18298166 0.87 TOP2A (0.39) TOP2ATOP2B
SCHEMBL28356386 0.82 TOP2A (0.36) TOP2ATOP2B
SCHEMBL5496734 0.81 TOP2A (0.35) TOP2ATOP2B
SCHEMBL5496738 0.81 TOP2A (0.35) TOP2ATOP2B
Hydrochloric Acid SCHEMBL818510 0.80 TOP2A (0.38) TOP2ATOP2B
Hydrochloric Acid SCHEMBL29829553 0.80 TOP2A (0.38) TOP2ATOP2B
SCHEMBL9659510 0.78 TOP2A (0.38) TOP2ATOP2B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 111 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2459607-B1 HYBRID COPOLYMER COMPOSITIONS FOR PERSONAL CARE APPLICATIONS NOURYON CHEMICALS INT BV (NL) 2021-04-14 EP claimed
US-9340498-B2 Raft polymerisation COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESERACH ORGANISATION (AU) 2016-05-17 US claimed
US-12516143-B2 Polystyrene-based polyampholyte having upper critical solution temperature, and application for same TOSOH FINECHEM CORPORATION (JP) 2026-01-06 US disclosed
US-20250222433-A1 METHOD FOR PRODUCING WATER-ABSORBING RESIN COMPOSITION SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2025-07-10 US disclosed
WO-2025126867-A1 WATER ABSORBENT RESIN PARTICLES, WATER ABSORBENT BODY, WATER ABSORBENT ARTICLE, AND METHOD FOR PRODUCING WATER ABSORBENT RESIN PARTICLES 住友精化株式会社 2025-06-19 WO disclosed
WO-2025070255-A1 METHOD FOR PRODUCING WATER ABSORBENT RESIN PARTICLES, AND METHOD FOR CONTROLLING PARTICLE DIAMETERS OF WATER ABSORBENT RESIN PARTICLES 住友精化株式会社 2025-04-03 WO disclosed
WO-2025013729-A1 METHOD FOR PRODUCING WATER-ABSORBENT RESIN PARTICLES, WATER-ABSORBING RESIN PARTICLES, ABSORBER, AND ABSORBENT ARTICLE 住友精化株式会社 2025-01-16 WO disclosed
WO-2025013730-A1 METHOD FOR PRODUCING WATER ABSORBENT RESIN PARTICLES, WATER ABSORBENT RESIN PARTICLES, ABSORBER, AND ABSORBENT ARTICLE 住友精化株式会社 2025-01-16 WO disclosed
WO-2024204234-A1 RESIN COMPOSITION, LIQUID CRYSTAL SEALANT, AND LIQUID CRYSTAL DISPLAY PANEL USING SAME 三井化学株式会社 2024-10-03 WO disclosed
EP-3896120-B1 WATER-ABSORBING RESIN PARTICLES, ABSORBENT, AND ABSORBENT ARTICLE SUMITOMO SEIKA CHEMICALS (JP) 2024-06-26 EP disclosed
US-20240123426-A1 METHOD FOR PRODUCING WATER ABSORBENT RESIN PARTICLES SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2024-04-18 US disclosed
WO-2004089994-A1 REMOVAL OF THIOCARBONYL END GROUPS OF POLYMERS SYMYX TECHNOLOGIES, INC. (US) 2004-10-21 WO disclosed
EP-0519439-B1 Binders for diazo resins FUJI PHOTO FILM CO LTD (JP) 1997-12-03 EP disclosed
EP-0398373-B1 Electrophotographic light-sensitive material FUJI PHOTO FILM CO LTD (JP) 1996-02-21 EP disclosed
EP-0389928-B1 Electrophotographic light-sensitive material FUJI PHOTO FILM CO LTD (JP) 1995-08-02 EP disclosed
US-5346975-A For wear resistant lithographic printing plates; photocrosslinkable; from maleimido group containing macromer FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
US-5314954-A Process for preparing aromatic polyester-polystyrene block copolymers UNITIKA LTD. (JP) 1994-05-24 US disclosed
US-5300397-A Enhanced sensitivity FUJI PHOTO FILM CO., LTD. (JP) 1994-04-05 US disclosed
US-5256735-A Solution polymerization of styrene polymers having terminal functional groups reactive with acid halide or hydroxyl groups, and aromatic dicarboxylic acid dihalides NIPPON STEEL CORPORATION (JP) 1993-10-26 US disclosed
EP-0519439-A2 Binders for diazo resins FUJI PHOTO FILM CO., LTD. (JP) 1992-12-23 EP disclosed