SCHEMBL22429

SCHEMBL22429

O=C(O)C1(C(=O)O)C=CC=C(c2ccccc2)C1(C(=O)O)C(=O)O

nearest known ligand 0.32

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
KMO O15229 1/20 0.32
AKR1C1 Q04828 1/20 0.32
MGLL Q99685 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16411907 0.89
SCHEMBL6428686 0.82 THRB (0.36) THRBTDP1KMOAKR1C1MGLL
SCHEMBL1173859 0.68
SCHEMBL30924492 0.66 ALDH1A1 (0.32)
SCHEMBL27599522 0.63 AKR1C1 (0.34) THRBTDP1KMOAKR1C1
Hydrochloric Acid SCHEMBL7518258 0.63 ALDH1A1 (0.33)
SCHEMBL17262675 0.62 THRB (0.31) THRBTDP1KMOAKR1C1
SCHEMBL30819686 0.62 THRB (0.40) THRBTDP1KMOMGLL
SCHEMBL19981082 0.62 ALDH1A1 (0.32)
SCHEMBL4619747 0.61 HDAC4 (0.33) THRBTDP1KMOAKR1C1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 86 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9598548-B2 Producing polymer foams comprising imide groups BASF SE (DE) 2017-03-21 US claimed
JP-8319470-A None JP disclosed
EP-4168523-B1 COMPOSITIONS AND THEIR USE BASF SE (DE) 2024-07-03 EP disclosed
US-11920000-B2 Alkoxylated polyamidoamines as dispersant agents BASF SE (DE) 2024-03-05 US disclosed
US-20230235250-A1 Compositions and Their Use BASF SE (DE) 2023-07-27 US disclosed
EP-3802665-B1 ALKOXYLATED POLYAMIDOAMINES AS DISPERSANT AGENTS BASF SE (DE) 2023-07-19 EP disclosed
US-11705555-B2 Electrolyte materials for use in electrochemical cells SION POWER CORPORATION (US) 2023-07-18 US disclosed
EP-4168523-A1 COMPOSITIONS AND THEIR USE BASF SE (DE) 2023-04-26 EP disclosed
US-20230027931-A1 THERMOPLASTIC MOULDING COMPOSITION CONTAINING POLYALKYLENE TEREPHTHALATE BASF SE (DE) 2023-01-26 US disclosed
CN-115268215-A Photosensitive polyimide resin composition, photosensitive polyimide film containing same and application of photosensitive polyimide resin composition 吉林奥来德光电材料股份有限公司 2022-11-01 CN disclosed
US-20070221096-A1 Novel Polyimide Film KANEKA CORPORATION (JP) 2007-09-27 US disclosed
EP-1728813-A1 Thermosetting solution composition and prepreg Ube Industries, Ltd. (JP) 2006-12-06 EP disclosed
EP-1117102-B1 Method of manufacturing material for forming insulating film JSR CORP (JP) 2005-08-10 EP disclosed
US-20040219376-A1 Heat resistant resin film with metal thin film, manufacturing method of the resin film, endless belt, manufacturing method of the belt, and image forming apparatus FUJI XEROX CO., LTD. (JP) 2004-11-04 US disclosed
US-6642352-B2 Providing a silicon inorganic polymer compound or polyarylenes or polyphenylene ether organic polymer compound, treating the polymeric compound with a zeta-potential producing filter material, and producing curable polymer compound JSR CORPORATION (JP) 2003-11-04 US disclosed
US-20020076515-A1 Heat resistant resin film with metal thin film, manufacturing method of the resin film, endless belt, manufacturing method of the belt, and image forming apparatus FUJI XEROX CO., LTD. (JP) 2002-06-20 US disclosed
US-20010009936-A1 Method of manufacturing material for forming insulating film JSR CORPORATION (JP) 2001-07-26 US disclosed
EP-1117102-A2 Method of manufacturing material for forming insulating film JSR Corporation (JP) 2001-07-18 EP disclosed
JP-H08319470-A HEAT-RESISTANT ADHESIVE MITSUI TOATSU CHEM INC 1996-12-03 JP disclosed
EP-0328027-A2 Novel soluble polyimidesiloxanes and methods for their preparation and use OCCIDENTAL CHEMICAL CORPORATION (US) 1989-08-16 EP disclosed