SCHEMBL22444809

SCHEMBL22444809

CO[Si](OC)(C(C)C)N1CCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL203745 0.67 MEN1 (0.30)
SCHEMBL26360833 0.65
SCHEMBL26073747 0.65
Cyclopropane SCHEMBL3269328 0.65 MEN1 (0.33)
SCHEMBL5611439 0.65 MEN1 (0.33)
SCHEMBL27516073 0.65 MEN1 (0.33)
SCHEMBL7777162 0.64
SCHEMBL15310064 0.63
SCHEMBL8075604 0.63 MEN1 (0.32)
SCHEMBL26965050 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230304155-A1 COMPOSITION FOR DEPOSITING A SILICON-CONTAINING LAYER AND METHOD OF DEPOSITING A SILICON-CONTAINING LAYER USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2023-09-28 US disclosed
CN-113574105-B Propylene resin composition, molded article, and propylene polymer 三井化学株式会社 2023-04-25 CN disclosed
US-20220145052-A1 PROPYLENE RESIN COMPOSITION, SHAPED ARTICLE AND PROPYLENE POLYMER MITSUI CHEMICALS, INC. (JP) 2022-05-12 US disclosed
EP-3943543-A1 PROPYLENE RESIN COMPOSITION, MOLDED BODY AND PROPYLENE POLYMER Mitsui Chemicals, Inc. (JP) 2022-01-26 EP disclosed
WO-2020189676-A1 PROPYLENE RESIN COMPOSITION, MOLDED BODY AND PROPYLENE POLYMER 三井化学株式会社 2020-09-24 WO disclosed