Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.33 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL188483 | 0.98 | ALDH1A1 (0.33) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL187847 | 0.86 | SMN1; SMN2 (0.38) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL5605833 | 0.86 | ALDH1A1 (0.33) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL27902437 | 0.84 | ALDH1A1 (0.32) | ALDH1A1 | |
| SCHEMBL1132658 | 0.84 | SMN1; SMN2 (0.46) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL4356077 | 0.83 | ALDH1A1 (0.42) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL27630827 | 0.82 | SMN1; SMN2 (0.39) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL188407 | 0.82 | SMN1; SMN2 (0.34) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL28063191 | 0.82 | SMN1; SMN2 (0.34) | ALDH1A1SMN1; SMN2TDP1 | |
| SCHEMBL187736 | 0.82 | ALDH1A1 (0.33) | ALDH1A1SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024063044-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2024-03-28 | — | — | WO | disclosed |
| WO-2024019064-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING POLYFUNCTIONAL SULFONIC ACID | 日産化学株式会社 | 2024-01-25 | — | — | WO | disclosed |
| WO-2024009993-A1 | METHOD OF MANUFACTURING LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT | 日産化学株式会社 | 2024-01-11 | — | — | WO | disclosed |
| WO-2023171733-A1 | WAFER EDGE PROTECTIVE FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING | 日産化学株式会社 | 2023-09-14 | — | — | WO | disclosed |
| WO-2023162968-A1 | PHOTOCURABLE RESIN COMPOSITION CONTAINING SELF-CROSSLINKING POLYMER | 日産化学株式会社 | 2023-08-31 | — | — | WO | disclosed |
| WO-2023157943-A1 | SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION HAVING UNSATURATED BOND AND CYCLIC STRUCTURE | 日産化学株式会社 | 2023-08-24 | — | — | WO | disclosed |
| WO-2023136250-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2023-07-20 | — | — | WO | disclosed |
| WO-2023085414-A1 | POLYCYCLIC AROMATIC HYDROCARBON-BASED PHOTO-CURABLE RESIN COMPOSITION | 日産化学株式会社 | 2023-05-19 | — | — | WO | disclosed |
| WO-2023037979-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, MULTILAYER BODY USING SAID COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT | 日産化学株式会社 | 2023-03-16 | — | — | WO | disclosed |
| WO-2023033094-A1 | WAFER EDGE PROTECTIVE-FILM-FORMING COMPOSITION FOR SEMICONDUCTOR MANUFACTURING | 日産化学株式会社 | 2023-03-09 | — | — | WO | disclosed |
| WO-2023008507-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM, AND SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2023-02-02 | — | — | WO | disclosed |
| WO-2022260154-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2022-12-15 | — | — | WO | disclosed |
| WO-2022210901-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2020196563-A1 | FILM-FORMING COMPOSITION | 日産化学株式会社 | 2020-10-01 | — | — | WO | disclosed |