Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RIPK1 | Q13546 | 1/20 | 0.49 |
| ▸ | IDO1 | P14902 | 2/20 | 0.46 |
| ▸ | MAPT | P10636 | 3/20 | 0.45 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.45 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.43 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | THRB | P10828 | 1/20 | 0.41 |
| ▸ | MEN1 | O00255 | 1/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.41 |
| ▸ | TP53 | P04637 | 1/20 | 0.41 |
| ▸ | CA12 | O43570 | 1/20 | 0.39 |
| ▸ | CA1 | P00915 | 1/20 | 0.39 |
| ▸ | CA2 | P00918 | 1/20 | 0.39 |
| ▸ | CA7 | P43166 | 1/20 | 0.39 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | RAB9A | P51151 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28672017 | 0.78 | HTT (0.48) | RIPK1IDO1MAPTCYP3A4KDM4E | |
| SCHEMBL27655643 | 0.77 | IDO1 (0.41) | RIPK1IDO1MAPTCYP3A4KDM4E | |
| SCHEMBL6891746 | 0.77 | RIPK1 (0.50) | RIPK1IDO1MAPTCYP3A4KDM4E | |
| SCHEMBL20686991 | 0.77 | RIPK1 (0.50) | RIPK1IDO1MAPTCYP3A4KDM4E | |
| Hydrochloric Acid SCHEMBL15101422 | 0.77 | MAPT (0.52) | RIPK1IDO1MAPTCYP3A4KDM4E | |
| SCHEMBL9844619 | 0.76 | IDO1 (0.43) | RIPK1IDO1MAPTCYP3A4KDM4E | |
| SCHEMBL20163215 | 0.75 | RIPK1 (0.49) | RIPK1IDO1MAPTCYP3A4KDM4E | |
| SCHEMBL10949413 | 0.75 | SLC6A2 (0.48) | RIPK1IDO1MAPTCYP3A4KDM4E | |
| SCHEMBL23609052 | 0.73 | RIPK1 (0.47) | RIPK1IDO1MAPTCYP3A4KDM4E | |
| SCHEMBL1847644 | 0.73 | RIPK1 (0.51) | RIPK1IDO1MAPTCYP3A4KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118984828-A | Compound, method for producing the compound, curable material, curable composition, method for producing cured product, and cured product | 株式会社艾迪科 | 2024-11-19 | — | — | CN | disclosed |
| CN-118369320-A | Compound, curable resin composition, and cured product | 株式会社艾迪科 | 2024-07-19 | — | — | CN | disclosed |
| CN-113544183-B | Curable resin composition | 株式会社艾迪科 | 2024-07-02 | — | — | CN | disclosed |
| CN-118076588-A | Inclusion compound, epoxy resin curing agent, and curable resin composition | 株式会社艾迪科 | 2024-05-24 | — | — | CN | disclosed |
| CN-118055978-A | Curable resin composition, cured product, and adhesive | 株式会社艾迪科 | 2024-05-17 | — | — | CN | disclosed |
| CN-117413002-A | Epoxy resin composition | 株式会社艾迪科 | 2024-01-16 | — | — | CN | disclosed |
| CN-115003726-B | Curable resin composition and method for inhibiting curing shrinkage of curable resin composition | 株式会社艾迪科 | 2023-12-05 | — | — | CN | disclosed |
| CN-117043221-A | Curable composition, cured product, fiber-reinforced composite material, and fiber-reinforced resin molded article | DIC株式会社 | 2023-11-10 | — | — | CN | disclosed |
| CN-116940613-A | Curable resin composition, cured product, and adhesive | 株式会社艾迪科 | 2023-10-24 | — | — | CN | disclosed |
| CN-116888184-A | Curable resin composition, cured product, and adhesive | 株式会社艾迪科 | 2023-10-13 | — | — | CN | disclosed |
| CN-116710436-A | Charge transfer complexes | 株式会社艾迪科 | 2023-09-05 | — | — | CN | disclosed |
| CN-115003709-A | Compound, method for producing compound, and curable composition | 株式会社艾迪科 | 2022-09-02 | — | — | CN | disclosed |
| CN-115003726-A | Curable resin composition and method for suppressing curing shrinkage of curable resin composition | 株式会社艾迪科 | 2022-09-02 | — | — | CN | disclosed |
| CN-114207039-A | Curable resin composition | 株式会社艾迪科 | 2022-03-18 | — | — | CN | disclosed |
| CN-113544183-A | Curable resin composition | 株式会社艾迪科 | 2021-10-22 | — | — | CN | disclosed |
| WO-2021112091-A1 | RESIN COMPOSITION | 株式会社ADEKA | 2021-06-10 | — | — | WO | disclosed |
| WO-2021095534-A1 | CURABLE COMPOSITION, CURED OBJECT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE AND PRODUCTION METHOD THEREFOR | DIC株式会社 | 2021-05-20 | — | — | WO | disclosed |
| WO-2021049390-A1 | CURABLE RESIN COMPOSITION | 株式会社ADEKA | 2021-03-18 | — | — | WO | disclosed |
| WO-2020196819-A1 | CURABLE RESIN COMPOSITION | 株式会社ADEKA | 2020-10-01 | — | — | WO | disclosed |
| CN-107001593-B | Thermosetting resin composition | 三键有限公司 | 2020-01-17 | — | — | CN | disclosed |