SCHEMBL225787

SCHEMBL225787

C=C(C(=O)O)C(CCCCCCCCCCCC)(CCCCCCCCCCCC)CCCCCCCCCCCC

nearest known ligand 0.47

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
GGPS1 O95749 6/20 0.45
FDPS P14324 9/20 0.44
SMPD1 P17405 2/20 0.42
CES2 O00748 1/20 0.42
LPAR1 Q92633 1/20 0.42
LPAR3 Q9UBY5 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6058687 1.00 GGPS1 (0.45) GGPS1FDPSSMPD1CES2LPAR1
Hydrochloric Acid SCHEMBL8731838 0.96 GGPS1 (0.42) GGPS1FDPSSMPD1CES2LPAR1
SCHEMBL6811305 0.91 FDPS (0.39) FDPS
SCHEMBL6448587 0.90 FDPS (0.39) GGPS1FDPSCES2
Phosphine SCHEMBL27681919 0.89 FDPS (0.38) GGPS1FDPS
SCHEMBL5419816 0.84 FDPS (0.42) FDPSSMPD1
SCHEMBL6446033 0.83 FDPS (0.36) GGPS1FDPS
SCHEMBL7996468 0.83 TSHR (0.69) CES2
SCHEMBL14245484 0.82 GGPS1 (0.48) GGPS1FDPSSMPD1CES2LPAR1
SCHEMBL9334810 0.80 GGPS1 (0.42) GGPS1FDPSSMPD1CES2LPAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11165045-B2 Organic light-emitting device and method of manufacturing the same SAMSUNG DISPLAY CO., LTD. (KR) 2021-11-02 US disclosed
EP-2740590-B1 PANEL AND PANEL INSTALLATION STRUCTURE MITSUBISHI ENG PLASTICS CORP (JP) 2021-03-31 EP disclosed
EP-2597120-B1 HIGHLY-THERMALLY-CONDUCTIVE POLYCARBONATE RESIN COMPOSITION AND MOLDED BODY MITSUBISHI ENG PLASTICS CORP (JP) 2020-12-09 EP disclosed
CN-110620185-A Organic light emitting device 三星显示有限公司 2019-12-27 CN disclosed
US-10373863-B2 Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure FUJIFILM CORPORATION (JP) 2019-08-06 US disclosed
US-9868846-B2 Curable composition for imprints, patterning method and pattern FUJIFILM CORPORATION (JP) 2018-01-16 US disclosed
US-9862847-B2 Inkjet discharge method, pattern formation method, and pattern FUJIFILM CORPORATION (JP) 2018-01-09 US disclosed
US-20170200639-A1 METHOD OF MANUFACTURING POROUS BODY, POROUS BODY, METHOD OF MANUFACTURING DEVICE, DEVICE, METHOD OF MANUFACTURING WIRING STRUCTURE, AND WIRING STRUCTURE FUJIFILM CORPORATION (JP) 2017-07-13 US disclosed
US-9482950-B2 Curable composition for imprints, pattern-forming method and pattern FUJIFILM CORPORATION (JP) 2016-11-01 US disclosed
US-9335628-B2 Curable composition for imprints, patterning method and pattern FUJIFILM CORPORATION (JP) 2016-05-10 US disclosed
CN-101896521-A Water-based paint compositions KANSAI PAINT CO LTD 2010-11-24 CN disclosed
US-20100255328-A1 WATER-BASED PAINT COMPOSITIONS KANSAI PAINT CO., LTD. (JP) 2010-10-07 US disclosed
US-20100244328-A1 CURABLE COMPOSITION FOR PHOTOIMPRINT, AND METHOD FOR PRODUCING CURED PRODUCT USING SAME FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20100133728-A1 CURABLE COMPOSITION FOR PHOTOIMPRINT, AND METHOD FOR PRODUCING CURED PRODUCT USING SAME FUJIFILM CORPORATION (JP) 2010-06-03 US disclosed
US-20100009138-A1 CURABLE COMPOSITION FOR IMPRINTS, PATTERNING METHOD AND PATTERN FUJIFILM CORPORATION (JP) 2010-01-14 US disclosed
US-20100009137-A1 COMPOSITION FOR IMPRINTS, PATTERN AND PATTERNING METHOD FUJIFILM CORPORATION (JP) 2010-01-14 US disclosed
US-7618685-B2 Release-treated substrate and method of producing the same NITTO DENKO CORPORATION (JP) 2009-11-17 US disclosed
WO-2009075389-A1 WATER-BASED PAINT COMPOSITIONS KANSAI PAINT CO., LTD. (JP) 2009-06-18 WO disclosed
US-20070036992-A1 forming a pressure-sensitive adhesive tape or sheet ; cationically polymerizable ultraviolet curing silicone resin; excellent adhesion between a release treating agent layer and substrate, storage stability NITTO DENKO CORPORATION 2007-02-15 US disclosed
US-6287723-B1 POLYMER OF ACRYLIC ESTER NIPPON ZEON CO., LTD. (JP) 2001-09-11 US disclosed