SCHEMBL226372

SCHEMBL226372

C=C(C)C(=O)N1CCCCCCCCCCCC1=O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.45
MITF O75030 1/20 0.45
LMNA P02545 2/20 0.44
KMT2A Q03164 3/20 0.38
MAPT P10636 3/20 0.37
KDM4E B2RXH2 3/20 0.37
MEN1 O00255 1/20 0.37
CYP1A2 P05177 1/20 0.37
CYP2D6 P10635 1/20 0.37
THRB P10828 1/20 0.37
CYP2C9 P11712 1/20 0.37
CYP2C19 P33261 1/20 0.37
RECQL P46063 1/20 0.37
BLM P54132 1/20 0.37
ALDH1A1 P00352 3/20 0.37
TP53 P04637 2/20 0.37
HSD17B10 Q99714 2/20 0.37
STAT6 P42226 1/20 0.37
BRD4 O60885 1/20 0.33
BRD2 P25440 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL225584 1.00 SMN1; SMN2 (0.45) SMN1; SMN2MITFLMNAKMT2AMAPT
SCHEMBL8067929 0.98 LMNA (0.46) SMN1; SMN2MITFLMNAKMT2AMAPT
SCHEMBL93484 0.92 LMNA (0.52) SMN1; SMN2MITFLMNAKMT2AMAPT
SCHEMBL12764294 0.84 ITGB1 (0.38) LMNAKMT2AMAPTKDM4EMEN1
SCHEMBL8379227 0.84 LMNA (0.54) SMN1; SMN2MITFLMNAKMT2AMAPT
SCHEMBL6822537 0.82 SMN1; SMN2 (0.45) SMN1; SMN2MITFLMNAKMT2AMAPT
SCHEMBL15061902 0.80 SMN1; SMN2 (0.50) SMN1; SMN2MITFLMNAKMT2AMAPT
SCHEMBL15061890 0.80 SMN1; SMN2 (0.50) SMN1; SMN2MITFLMNAKMT2AMAPT
SCHEMBL8379280 0.80 SMN1; SMN2 (0.50) SMN1; SMN2MITFLMNAKMT2AMAPT
SCHEMBL15071000 0.80 SMN1; SMN2 (0.50) SMN1; SMN2MITFLMNAKMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3296345-B1 HYDROLYTICALLY STABLE POLYAMIDE BLEND EVONIK OPERATIONS GMBH (DE) 2021-02-24 EP disclosed
EP-2998339-B1 METALLIC PIPE HAVING A HYDROLYSIS-RESISTANT LAYER OF A POLYAMIDE MOULDING COMPOSITION EVONIK DEGUSSA GMBH (DE) 2019-01-30 EP disclosed
US-10072786-B2 Use of a conduit pipe for producing a duct laid in water EVONIK DEGUSSA GMBH (DE) 2018-09-11 US disclosed
EP-2367883-B1 USE OF A COMPOSITION FOR THE CONTACT WITH SUPERCRITICAL MEDIA EVONIK DEGUSSA GMBH (DE) 2018-07-25 EP disclosed
EP-3296345-A1 HYDROLYTICALLY STABLE POLYAMIDE BLEND Evonik Degussa GmbH (DE) 2018-03-21 EP disclosed
US-9919494-B2 Metallic pipe having a hydrolysis-resistant layer of a polyamide moulding composition EVONIK DEGUSSA GMBH (DE) 2018-03-20 US disclosed
EP-2558285-B1 FLEXIBLE PIPE HAVING A DIFFUSION BARRIER EVONIK DEGUSSA GMBH (DE) 2017-08-16 EP disclosed
US-9574700-B2 Method of producing an underground pipeline EVONIK DEGUSSA GMBH (DE) 2017-02-21 US disclosed
US-9314989-B2 Flexible pipe having a multi-layered structure EVONIK DEGUSSA GMBH (DE) 2016-04-19 US disclosed
EP-2998339-A2 METALLIC PIPE HAVING A HYDROLYSIS-RESISTANT LAYER OF A POLYAMIDE MOULDING COMPOSITION Evonik Degussa GmbH (DE) 2016-03-23 EP disclosed
CN-1200974-C Polymer blend of low temp. impact strength DEGUSSA (DE) 2005-05-11 CN disclosed
US-6660796-B2 Anhydride group-containing ethylene-alpha-olefin copolymer or styrene-ethylene/butylene block copolymer as impact modifier; ethylene-acrylic monomer terpolymer DEGUSSA AG (DE) 2003-12-09 US disclosed
US-6579581-B2 Molding materials; polyamide and addition polymer blend DEGUSSA AG (DE) 2003-06-17 US disclosed
US-20020115771-A1 Polyester molding composition DEGUSSA AG (DE) 2002-08-22 US disclosed
CN-1359976-A Polyester moulding composition DEGUSSA (DE) 2002-07-24 CN disclosed
EP-1217038-A2 Polyester moulding composition Degussa AG (DE) 2002-06-26 EP disclosed
US-20020019477-A1 Molding materials; polyamide and addition polymer blend DEGUSSA-HUELS AKTIENGESELLSCHAFT (DE) 2002-02-14 US disclosed
EP-1170334-A2 Low-temperature shock resistant polyamide moulding Degussa AG (DE) 2002-01-09 EP disclosed
CN-1330111-A Polymer blend of low temp. impact strength DEGUSSA (DE) 2002-01-09 CN disclosed
US-4847322-A Thermoplastic compositions containing acyllactam graft linkages ALLIED-SIGNAL INC. (US) 1989-07-11 US disclosed