SCHEMBL2265750

SCHEMBL2265750

CC1=CC[C@H]2C(=O)OC(=O)[C@H]2C1

nearest known ligand 0.49

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
FNTA P49354 3/20 0.49
PGGT1B P53609 2/20 0.49
FNTB P49356 1/20 0.42
TSHR P16473 4/20 0.39
GAA P10253 2/20 0.39
KMT2A Q03164 2/20 0.37
MEN1 O00255 1/20 0.37
USP2 O75604 1/20 0.37
ALDH1A1 P00352 6/20 0.36
TDP1 Q9NUW8 2/20 0.36
POLB P06746 2/20 0.36
APEX1 P27695 1/20 0.36
RXFP1 Q9HBX9 1/20 0.35
HPGD P15428 1/20 0.35
CNR1 P21554 1/20 0.32
MAPT P10636 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2265747 1.00 FNTA (0.49) FNTAPGGT1BFNTBTSHRGAA
SCHEMBL354462 1.00 FNTA (0.49) FNTAPGGT1BFNTBTSHRGAA
SCHEMBL9563129 0.94 FNTA (0.45) FNTAPGGT1BFNTBTSHRGAA
SCHEMBL11213545 0.85 FNTA (0.43) FNTAPGGT1BFNTBTSHRGAA
SCHEMBL19353755 0.80 TAS2R46 (0.40) FNTAPGGT1BFNTBKMT2AMEN1
Monomethyl Fumarate SCHEMBL3694665 0.78 HCAR2 (0.44) FNTAPGGT1BFNTBTSHRKMT2A
Monomethyl Fumarate SCHEMBL3694667 0.78 HCAR2 (0.44) FNTAPGGT1BFNTBTSHRKMT2A
SCHEMBL23504250 0.75 FNTA (0.45) FNTAPGGT1BFNTB
SCHEMBL9450249 0.75 FNTA (0.45) FNTAPGGT1BFNTB
SCHEMBL8533602 0.75 ALDH1A1 (0.46) FNTAPGGT1BFNTBTSHRKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3243854-B1 LOW DK/DF SOLDER RESISTANT COMPOSITION USED FOR PRINTED CIRCUIT BOARD NANYA PLASTICS CORP (TW) 2020-11-18 EP claimed
US-20170363958-A1 LOW DK/DF SOLDER RESISTANT COMPOSITION USE FOR PRINTED CIRCUIT BOARD NAN YA PLASTICS CORPORATION (TW) 2017-12-21 US claimed
EP-3243854-B1 LOW DK/DF SOLDER RESISTANT COMPOSITION USED FOR PRINTED CIRCUIT BOARD NANYA PLASTICS CORP (TW) 2020-11-18 EP disclosed
US-20170363958-A1 LOW DK/DF SOLDER RESISTANT COMPOSITION USE FOR PRINTED CIRCUIT BOARD NAN YA PLASTICS CORPORATION (TW) 2017-12-21 US disclosed
EP-3243854-A1 LOW DK/DF SOLDER RESISTANT COMPOSITION USE FOR PRINTED CIRCUIT BOARD Nan-Ya Plastics Corporation (TW) 2017-11-15 EP disclosed
US-8362151-B2 Hybrid polymer materials for liquid crystal alignment layers ELSICON, INC. (US) 2013-01-29 US disclosed
EP-2513157-A1 HYBRID POLYMER MATERIALS FOR LIQUID CRYSTAL ALIGNMENT LAYERS Li, Chunhong (US) 2012-10-24 EP disclosed
WO-2011084546-A1 HYBRID POLYMER MATERIALS FOR LIQUID CRYSTAL ALIGNMENT LAYERS LI CHUNHONG (US) 2011-07-14 WO disclosed
US-20100305230-A1 HYBRID POLYMER MATERIALS FOR LIQUID CRYSTAL ALIGNMENT LAYERS ELSICON, INC. (US) 2010-12-02 US disclosed
EP-1489108-B1 HYDROCARBON POLYMER COMPOSITIONS AND MOLDING ZEON CORP (JP) 2010-11-24 EP disclosed
US-20100103358-A1 HYBRID POLYMER MATERIALS FOR LIQUID CRYSTAL ALIGNMENT LAYERS ELSICON, INC. (US) 2010-04-29 US disclosed
US-20060051524-A1 Hybrid polymer materials for liquid crystal alignment layers ELSICON, INC. 2006-03-09 US disclosed
US-6919404-B2 Hybrid polymer materials for liquid crystal alignment layers ELSICON, INC. (US) 2005-07-19 US disclosed
US-20050131149-A1 Modifier for hydrocarbon polymers, hydrocarbon polymer composition and moldings ZEON CORPORATION (JP) 2005-06-16 US disclosed
EP-1489108-A1 MODIFIER FOR HYDROCARBON POLYMERS, HYDROCARBON POLYMER COMPOSITIONS AND MOLDINGS ZEON CORPORATION (JP) 2004-12-22 EP disclosed
US-20030232930-A1 Hybrid polymer materials for liquid crystal alignment layers ELSICON, INC. 2003-12-18 US disclosed
WO-2003102045-A1 HYBRID POLYMER MATERIALS FOR LIQUID CRYSTAL ALIGNMENT LAYERS ELSICON, INC. (US) 2003-12-11 WO disclosed
EP-1270637-A1 POLYESTER AND POLYMER MODIFIER COMPRISING THE POLYESTER AS ACTIVE INGREDIENT Zeon Corporation (JP) 2003-01-02 EP disclosed
US-20020193556-A1 Polyester and polymer modifier comprising the polyester as active ingredient ZEON CORPORATION (JP) 2002-12-19 US disclosed
US-5039746-A Solvent resistant; engineering thermoplastics HUELS AKTIENGESELLSCHAFT (DE) 1991-08-13 US disclosed