SCHEMBL226644

SCHEMBL226644

CC[CH]NCCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5614099 0.83
SCHEMBL27506086 0.81
SCHEMBL2425068 0.79 PAOX (0.45)
SCHEMBL4847573 0.78
SCHEMBL16059184 0.77
SCHEMBL3040316 0.75
SCHEMBL217777 0.75
SCHEMBL1548753 0.72
SCHEMBL1548751 0.72
SCHEMBL1329932 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 181 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110330782-A A kind of preparation method of modified graphene oxide/polyurethane heat resistant composite material 江苏理工学院 2019-10-15 CN claimed
CN-108654560-A A kind of preparation method for the adsorbent of separating formaldehyde from air 安徽乐金环境科技有限公司 2018-10-16 CN claimed
CN-107540385-A A kind of green compact leaching liquid for improving ceramics strength 安徽青花坊瓷业股份有限公司 2018-01-05 CN claimed
CN-107473721-A A kind of antibacterial intensified ceramic vessel and preparation method thereof 安徽青花坊瓷业股份有限公司 2017-12-15 CN claimed
CN-105733311-B A kind of preparation method of the surface modified carbon SiClx based on oil base grinding and polishing liquid 天津大学 2017-10-17 CN claimed
EP-1967550-B9 ROOM TEMPERATURE CURABLE SILICON GROUP-CONTAINING POLYMER COMPOSITION MOMENTIVE PERFORMANCE MAT JP (JP) 2016-11-09 EP claimed
EP-1967550-B1 ROOM TEMPERATURE CURABLE SILICON GROUP-CONTAINING POLYMER COMPOSITION MOMENTIVE PERFORMANCE MAT JP (JP) 2014-01-22 EP claimed
EP-2093247-B1 Triazinethiol and alkenyl-containing organopolysiloxane, making method, and primer composition comprising same SHINETSU CHEMICAL CO (JP) 2013-01-09 EP claimed
US-8110637-B2 Room temperature curable silicon group-containing polymer composition Momenive Performance Materials Japan LLC (JP) 2012-02-07 US claimed
US-7674870-B2 Triazinethiol and alkenyl-containing organopolysiloxane, making method, and primer composition comprising same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-03-09 US claimed
EP-2093247-A1 Triazinethiol and alkenyl-containing organopolysiloxane, making method, and primer composition comprising same Shin-Etsu Chemical Co., Ltd. (JP) 2009-08-26 EP claimed
US-20090209691-A1 TRIAZINETHIOL AND ALKENYL-CONTAINING ORGANOPOLYSILOXANE, MAKING METHOD, AND PRIMER COMPOSITION COMPRISING SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2009-08-20 US claimed
US-20090088523-A1 Room Temperature Curable Silicon Group-Containing Polymer Composition MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC 2009-04-02 US claimed
EP-1967550-A1 ROOM TEMPERATURE CURABLE SILICON GROUP-CONTAINING POLYMER COMPOSITION Momentive Performance Materials Japan LLC (JP) 2008-09-10 EP claimed
EP-0857770-B1 Coating compositions, hydrophilic films, and hydrophilic film-coated articles SHINETSU CHEMICAL CO (JP) 2004-09-22 EP claimed
US-6114440-A EMULSION POLYMERIZING AN AQUEOUS SOLUTION OF A WATER-INSOLUBLE GROUP-BEARING SILICONE RESIN AND A VINYL SILANETRIOL MONOMER; COATED AND CURED INTO A FILM HAVING WEAR AND CHEMICAL RESISTANCE AND WATERPROOFING PROPERTIES SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-09-05 US claimed
US-5973068-A BLEND OF WATER INSOLUBLE SILICONE RESIN AND VINYL MONOMER SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-10-26 US claimed
US-20240209416-A1 METHOD FOR MODIFYING SURFACE OF SUBSTRATE AND METHOD FOR IMMOBILIZING OLIGONUCLEOTIDE INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2024-06-27 US disclosed
EP-0752441-A2 Organopolysiloxane resin, production method thereof, and curable organopolysiloxane resin composition using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 1997-01-08 EP disclosed
US-5240984-A Molding material having excellent storage stability, heat resistance and fire resistance without causing blooming SHIN-ETSU CHEMICAL CO., LTD. (JP) 1993-08-31 US disclosed