SCHEMBL2268206

SCHEMBL2268206

CCN(CC)C(C)[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL329234 0.74 FDPS (0.35)
SCHEMBL27131003 0.73 FDPS (0.39)
SCHEMBL437673 0.69 FDPS (0.36)
SCHEMBL20811 0.69
SCHEMBL2567591 0.69 FDPS (0.36)
SCHEMBL2268586 0.69
SCHEMBL27131531 0.69 MMP1 (0.33)
SCHEMBL2273840 0.69
SCHEMBL2271246 0.69
SCHEMBL2102047 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260076110-A1 HYBRID ATOMIC LAYER DEPOSITION LAM RES CORP (US) 2026-03-12 US disclosed
US-20250372367-A1 DEPOSITION AND ETCH OF SILICON-CONTAINING LAYER LAM RES CORP (US) 2025-12-04 US disclosed
US-20250197996-A1 LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NITRIDE LAM RES CORP (US) 2025-06-19 US disclosed
US-20250188609-A1 SEAM-FREE AND CRACK-FREE DEPOSITION LAM RES CORP (US) 2025-06-12 US disclosed
US-20250166989-A1 THERMAL FILM DEPOSITION LAM RES CORP (US) 2025-05-22 US disclosed
CN-119604963-A Hybrid atomic layer deposition 朗姆研究公司 2025-03-11 CN disclosed
CN-119487614-A Deposition and etching of silicon-containing layers 朗姆研究公司 2025-02-18 CN disclosed
US-20250054747-A1 CONFORMAL DEPOSITION OF SILICON NITRIDE LAM RES CORP (US) 2025-02-13 US disclosed
US-20250038003-A1 LOW TEMPERATURE MOLYBDENUM DEPOSITION ASSISTED BY SILICON-CONTAINING REACTANTS LAM RESEARCH CORPORATION (US) 2025-01-30 US disclosed
US-20250014890-A1 CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF LAM RESEARCH CORPORATION 2025-01-09 US disclosed
EP-0172579-B1 MODIFIED SILICEOUS SUPPORTS Cuno Incorporated (US) 1992-11-19 EP disclosed
EP-0112434-B1 HYDROGEN BEARING SILYL CARBAMATES UNION CARBIDE CORPORATION (US) 1988-08-17 EP disclosed
EP-0273456-A2 Vapor phase alcoholysis of aminosilanes and carbamatosilanes UNION CARBIDE CORPORATION (US) 1988-07-06 EP disclosed
US-4730074-A Vapor phase alcoholysis of aminosilanes and carbamatosilanes UNION CARBIDE CORPORATION (US) 1988-03-08 US disclosed
US-4724207-A SILICA BONDED TO POLYMER GROUPS CUNO INCORPORATED (US) 1988-02-09 US disclosed
EP-0098912-B1 PROCESS FOR THE PREPARATION OF ALKOXYHYDRIDOSILANES UNION CARBIDE CORPORATION (US) 1986-04-23 EP disclosed
EP-0172579-A2 Modified siliceous supports Cuno Incorporated (US) 1986-02-26 EP disclosed
EP-0098911-A1 Improved process for the preparation of oximatohydridosilanes and aminoxyhydridosilanes UNION CARBIDE CORPORATION (US) 1984-01-25 EP disclosed
US-4395564-A REACTING AN ALCOHOL WITH SILYL-AMINE UNION CARBIDE CORPORATION (US) 1983-07-26 US disclosed
US-4384131-A Process for the preparation of oximatohydridosilanes and aminoxyhydridosilanes UNION CARBIDE CORPORATION (US) 1983-05-17 US disclosed