SCHEMBL2268375

SCHEMBL2268375

CN[SiH](c1ccccc1)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.41
KCNN4 O15554 1/20 0.36
KDM4E B2RXH2 2/20 0.35
MAPT P10636 2/20 0.35
CYP3A4 P08684 1/20 0.35
TDP1 Q9NUW8 4/20 0.33
ALDH1A1 P00352 4/20 0.33
TAAR1 Q96RJ0 4/20 0.33
HSD17B10 Q99714 3/20 0.33
L3MBTL1 Q9Y468 3/20 0.33
LMNA P02545 2/20 0.33
ALOX12 P18054 2/20 0.33
ACHE P22303 1/20 0.33
ATM Q13315 1/20 0.33
USP2 O75604 1/20 0.33
POLB P06746 1/20 0.33
HPGD P15428 1/20 0.33
RECQL P46063 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
CTSD P07339 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2101602 0.77 TSHR (0.41) TSHRKCNN4KDM4EMAPTCYP3A4
SCHEMBL12273825 0.75 TDP1 (0.35) TSHRCYP3A4TDP1ALDH1A1HSD17B10
SCHEMBL28215148 0.74 TSHR (0.46) TSHRKCNN4KDM4EMAPTCYP3A4
SCHEMBL2270141 0.74 TSHR (0.39) TSHRKCNN4KDM4EMAPTCYP3A4
SCHEMBL16271849 0.72 TSHR (0.38) TSHRKCNN4KDM4EMAPTCYP3A4
SCHEMBL2101473 0.72 TSHR (0.38) TSHRKCNN4KDM4EMAPTCYP3A4
SCHEMBL28114301 0.72 TSHR (0.32) TSHRKCNN4LMNAALOX12ACHE
SCHEMBL2542387 0.71 TSHR (0.35) TSHRTDP1ALDH1A1HSD17B10L3MBTL1
Dimethylamine SCHEMBL10623601 0.71 TSHR (0.41) TSHRKCNN4KDM4EMAPTCYP3A4
SCHEMBL2268660 0.70 KCNN4 (0.38) TSHRKCNN4KDM4EMAPTCYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240368427-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, OPTICAL COMPONENT, AND COMPOSITE MEMBER JNC CORPORATION (JP) 2024-11-07 US disclosed
EP-4386053-A2 SILOXANE POLYMER COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, OPTICAL COMPONENT, AND COMPOSITE MEMBER JNC Corporation (JP) 2024-06-19 EP disclosed
CN-117795010-A Silicone polymer composition, cured product, electronic component, optical component, and composite member 捷恩智株式会社 2024-03-29 CN disclosed
WO-2022215759-A2 SILOXANE POLYMER COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, OPTICAL COMPONENT, AND COMPOSITE MEMBER JNC株式会社 2022-10-13 WO disclosed
US-10669422-B2 Condensation-curable silicone resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-06-02 US disclosed
US-20180051138-A1 CONDENSATION-CURABLE SILICONE RESIN COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-02-22 US disclosed
EP-3284788-A1 CONDENSATION-CURABLE SILICONE RESIN COMPOSITION Shin-Etsu Chemical Co., Ltd. (JP) 2018-02-21 EP disclosed
US-8404584-B2 Method of manufacturing semiconductor device FUJITSU LIMITED (JP) 2013-03-26 US disclosed
US-20110207319-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-08-25 US disclosed