Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL22686502

CCC(N)(C(C)C)C(C)C.N

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2481172 0.97
SCHEMBL28568734 0.85
Nitrous Acid SCHEMBL5509794 0.81 CA1 (0.30)
SCHEMBL21657784 0.79
SCHEMBL31531230 0.72
Ammonia Solution, Strong SCHEMBL28391001 0.71 FDPS (0.38)
SCHEMBL1131877 0.71 TSHR (0.37)
SCHEMBL640974 0.71 FDPS (0.35)
SCHEMBL2479174 0.71 TSHR (0.30)
SCHEMBL25275043 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117872693-A Positive photoresist stripping solution, preparation method and application thereof 深圳市松柏科工股份有限公司 2024-04-12 CN claimed
CN-116964122-A Polyurea copolymers 巴斯夫欧洲公司 2023-10-27 CN claimed
CN-117872693-B Positive photoresist stripping solution, preparation method and application thereof 深圳市松柏科工股份有限公司 2024-07-12 CN disclosed
CN-117872693-A Positive photoresist stripping solution, preparation method and application thereof 深圳市松柏科工股份有限公司 2024-04-12 CN disclosed
CN-114555556-B Process for preparing CFTR modulators 弗特克斯药品有限公司 2024-03-29 CN disclosed
CN-116964122-A Polyurea copolymers 巴斯夫欧洲公司 2023-10-27 CN disclosed
CN-115315783-A Laminate, method for producing laminate, and method for producing semiconductor substrate 东京应化工业株式会社 2022-11-08 CN disclosed
CN-114555556-A Methods of making CFTR modulators 弗特克斯药品有限公司 2022-05-27 CN disclosed
CN-109970574-B Preparation method of N, N-diisopropyl-1, 3-propane diamine 中北大学 2022-04-15 CN disclosed
US-11120993-B2 Diffusing agent composition and method of manufacturing semiconductor substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2021-09-14 US disclosed
US-20200373162-A1 DIFFUSING AGENT COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2020-11-26 US disclosed