SCHEMBL22733765

SCHEMBL22733765

O=c1ooooc(=O)o1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1921748 0.78
SCHEMBL1258779 0.77
SCHEMBL17200997 0.73
SCHEMBL15632646 0.73
SCHEMBL7694892 0.73
SCHEMBL6206429 0.71
SCHEMBL7573914 0.56
SCHEMBL6910592 0.54
SCHEMBL856949 0.52 MAOA (0.38)
SCHEMBL5535356 0.50

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 164 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3604439-B1 RUBBER COMPOSITION AND CROSSLINKED RUBBER ZEON CORP (JP) 2026-01-14 EP claimed
EP-4558581-A1 APPLICATION OF ORGANIC OXIDIZER AND ENZYME COMBINATION AS BREAKER FLUID FOR FILTER CAKE CLEANUP Services Pétroliers Schlumberger (FR) 2025-05-28 EP claimed
CN-119505335-A Acrylic acid adsorption foam and foam adhesive tape 苏州翎慧材料科技有限公司 2025-02-25 CN claimed
EP-4466300-A1 A THERMOSET COMPOSITE COMPRISING A CROSSLINKED IMIDE EXTENDED COMPOUND Rogers Corporation (US) 2024-11-27 EP claimed
CN-118974149-A Open cell polymer foam composition with adjustable tortuosity and preparation method thereof 布拉斯科有限公司 2024-11-15 CN claimed
US-12055853-B2 Photosensitive resin composition, laminate, and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-08-06 US claimed
EP-4370644-A1 CONSUMER PRODUCTS COMPRISING DELIVERY PARTICLES WITH HIGH CORE:WALL RATIOS The Procter & Gamble Company (US) 2024-05-22 EP claimed
US-11931931-B2 Laminated films and methods of making and using same CARIFLEX PTE. LTD. (SG) 2024-03-19 US claimed
WO-2024048156-A1 RESIN COMPOSITION, CURED PRODUCT OF RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT ナミックス株式会社 2024-03-07 WO claimed
WO-2024020339-A1 APPLICATION OF ORGANIC OXIDIZER AND ENZYME COMBINATION AS BREAKER FLUID FOR FILTER CAKE CLEANUP SCHLUMBERGER TECHNOLOGY CORPORATION (US) 2024-01-25 WO claimed
US-11742519-B2 Silicon-based energy storage devices with electrolyte additive compounds ENEVATE CORPORATION (US) 2023-08-29 US claimed
WO-2023288239-A1 CONSUMER PRODUCTS COMPRISING DELIVERY PARTICLES WITH HIGH CORE:WALL RATIOS THE PROCTER & GAMBLE COMPANY (US) 2023-01-19 WO claimed
US-11547639-B2 Dental composition containing platinum nanoparticles KURARAY NORITAKE DENTAL INC. (JP) 2023-01-10 US claimed
US-11332610-B2 Rubber composition and crosslinked rubber ZEON CORPORATION (JP) 2022-05-17 US claimed
US-20200388880-A1 SILICON-BASED ENERGY STORAGE DEVICES WITH ELECTROLYTE ADDITIVE COMPOUNDS ENEVATE CORPORATION 2020-12-10 US claimed
US-20260117099-A1 ADHESIVE FILM AND OPTICAL DISPLAY APPARATUS COMPRISING THE SAME SAMSUNG SDI CO LTD (KR) 2026-04-30 US disclosed
US-12606662-B2 Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board RESONAC CORPORATION (JP) 2026-04-21 US disclosed
US-11242472-B2 Adhesive film SHOWA DENKO MATERIALS CO., LTD. (JP) 2022-02-08 US disclosed
WO-2022025133-A1 MICROCAPSULE PRODUCTION METHOD 森下仁丹株式会社 2022-02-03 WO disclosed
US-20200388880-A1 SILICON-BASED ENERGY STORAGE DEVICES WITH ELECTROLYTE ADDITIVE COMPOUNDS ENEVATE CORPORATION 2020-12-10 US disclosed