⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2268135 | 0.83 | — | — | |
| SCHEMBL2271212 | 0.75 | — | — | |
| SCHEMBL5881449 | 0.69 | — | — | |
| SCHEMBL5881396 | 0.69 | — | — | |
| SCHEMBL3482292 | 0.69 | — | — | |
| SCHEMBL3482607 | 0.67 | — | — | |
| SCHEMBL8769608 | 0.67 | — | — | |
| SCHEMBL31506748 | 0.66 | LMNA (0.37) | — | |
| SCHEMBL2269605 | 0.65 | — | — | |
| Methyl Alcohol SCHEMBL6428926 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116854923-A | Boron-containing tackifier for silicone rubber and preparation method and application thereof | 中国科学院化学研究所 | 2023-10-10 | — | — | CN | claimed |
| CN-116855223-A | High-bonding-strength organic silicon bonding sealant and preparation method and application thereof | 中国科学院化学研究所 | 2023-10-10 | — | — | CN | claimed |
| CN-116854923-A | Boron-containing tackifier for silicone rubber and preparation method and application thereof | 中国科学院化学研究所 | 2023-10-10 | — | — | CN | disclosed |
| CN-116855223-A | High-bonding-strength organic silicon bonding sealant and preparation method and application thereof | 中国科学院化学研究所 | 2023-10-10 | — | — | CN | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| CN-102471581-B | Curable composition for semiconductor encapsulation | ADEKA CORP | 2015-01-28 | — | — | CN | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| CN-101641767-B | Silicon dielectric treating agent for use after etching, process for producing semiconductor device, and semiconductor device | FUJITSU LTD | 2013-10-30 | — | — | CN | disclosed |
| US-8404584-B2 | Method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2013-03-26 | — | — | US | disclosed |
| CN-102532911-A | Silicon-containing curable composition | ADEKA CORP | 2012-07-04 | — | — | CN | disclosed |
| CN-102471581-A | Curable composition for semiconductor encapsulation | ADEKA CORP | 2012-05-23 | — | — | CN | disclosed |
| US-20110207319-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-08-25 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| WO-2007120014-A1 | SURFACE MODIFIED ORGANIC·INORGANIC HYBRID GLASS, PROTECTING GROUP INDUCED ALCOHOL OR ITS DERIVATIVE AND PRODUCING METHOD THEREOF | INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY (KR) | 2007-10-25 | — | — | WO | disclosed |