SCHEMBL2278154

SCHEMBL2278154

CCO[Si](C)(C)C1CCCC(C2CCCCCC2)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1314190 0.88 SHBG (0.31)
SCHEMBL1169447 0.86
SCHEMBL2276206 0.85
SCHEMBL2274018 0.73 ALDH1A1 (0.40)
SCHEMBL28434138 0.72 CYP1A2 (0.33)
SCHEMBL1313401 0.71 SHBG (0.31)
SCHEMBL7149995 0.71 ALDH1A1 (0.32)
SCHEMBL196806 0.71 SHBG (0.31)
SCHEMBL8761890 0.71 SHBG (0.31)
SCHEMBL13270307 0.71 SHBG (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130260575-A1 SILICON PRECURSORS AND COMPOSITIONS COMPRISING SAME FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-03 US claimed
WO-2011106218-A2 ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION APPLIED MATERIALS, INC. (US) 2011-09-01 WO claimed
US-20110206857-A1 ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION APPLIED MATERIALS, INC. (US) 2011-08-25 US claimed
US-20130260575-A1 SILICON PRECURSORS AND COMPOSITIONS COMPRISING SAME FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-03 US disclosed
US-20110206857-A1 ULTRA LOW DIELECTRIC MATERIALS USING HYBRID PRECURSORS CONTAINING SILICON WITH ORGANIC FUNCTIONAL GROUPS BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION APPLIED MATERIALS, INC. (US) 2011-08-25 US disclosed