Formaldehyde

Formaldehyde

SCHEMBL22802133

C=O.CCc1cc(-c2cc(CC)c(N)c(CC)c2)cc(CC)c1N.CCc1cc(-c2cc(CC)c(N)c(CC)c2)cc(CC)c1N

nearest known ligand 0.50

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.50
POLB P06746 2/20 0.50
ALDH1A1 P00352 3/20 0.38
TP53 P04637 1/20 0.38
CYP3A4 P08684 1/20 0.38
TSHR P16473 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
MAPT P10636 2/20 0.37
NOS3 P29474 1/20 0.35
NOS1 P29475 1/20 0.35
NOS2 P35228 1/20 0.35
GABRP O00591 1/20 0.31
GABRD O14764 1/20 0.31
GABRA1 P14867 1/20 0.31
GABRB1 P18505 1/20 0.31
GABRG2 P18507 1/20 0.31
GABRB3 P28472 1/20 0.31
GABRA5 P31644 1/20 0.31
GABRA3 P34903 1/20 0.31
GABRA2 P47869 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2186186 0.95 HTT (0.54) HTTPOLBALDH1A1TP53CYP3A4
Methane SCHEMBL27855766 0.92 HTT (0.52) HTTPOLBALDH1A1TP53CYP3A4
Hydrochloric Acid SCHEMBL9751581 0.92 HTT (0.52) HTTPOLBALDH1A1TP53CYP3A4
SCHEMBL29656878 0.92 HTT (0.52) HTTPOLBALDH1A1TP53CYP3A4
SCHEMBL20572544 0.90 HTT (0.50) HTTPOLBALDH1A1TP53CYP3A4
SCHEMBL20572995 0.83 HTT (0.45) HTTPOLBALDH1A1TP53CYP3A4
SCHEMBL10979678 0.81 TDP1 (0.48) HTTPOLBALDH1A1TP53CYP3A4
SCHEMBL7615550 0.81 POLB (0.44) HTTPOLBALDH1A1TP53CYP3A4
SCHEMBL9325247 0.80 ALDH1A1 (0.59) HTTPOLBALDH1A1TP53CYP3A4
Methane SCHEMBL21294037 0.78 ALDH1A1 (0.56) HTTPOLBALDH1A1TP53CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3590991-B1 EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES (JP) 2024-05-01 EP disclosed
US-11319435-B2 Heat-curable resin composition, prepreg, and fiber-reinforced composite material TORAY INDUSTRIES, INC. (JP) 2022-05-03 US disclosed
EP-3760661-A1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL Toray Industries, Inc. (JP) 2021-01-06 EP disclosed
US-20200399462-A1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2020-12-24 US disclosed