Formaldehyde

Formaldehyde

SCHEMBL22802134

C=O.CC(C)c1cc(-c2ccc(N)c(C(C)C)c2)ccc1N.CC(C)c1cc(-c2ccc(N)c(C(C)C)c2)ccc1N

nearest known ligand 0.43

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.43
TDP1 Q9NUW8 4/20 0.43
CYP3A4 P08684 4/20 0.43
TSHR P16473 3/20 0.43
KMT2A Q03164 4/20 0.42
MEN1 O00255 3/20 0.42
HSD17B10 Q99714 3/20 0.39
POLB P06746 3/20 0.39
KDM4E B2RXH2 2/20 0.39
MAPK1 P28482 2/20 0.39
MAPT P10636 2/20 0.39
HPGD P15428 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
CA1 P00915 2/20 0.38
CA2 P00918 2/20 0.38
ALOX15 P16050 1/20 0.38
GFER P55789 2/20 0.38
RXFP1 Q9HBX9 1/20 0.38
THRB P10828 1/20 0.35
CA12 O43570 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2155134 0.93 ALDH1A1 (0.48) ALDH1A1TDP1CYP3A4TSHRKMT2A
Hydrochloric Acid SCHEMBL9800282 0.91 ALDH1A1 (0.46) ALDH1A1TDP1CYP3A4TSHRKMT2A
Sulfur Dioxide SCHEMBL20572685 0.89 ALDH1A1 (0.41) ALDH1A1TDP1CYP3A4TSHRKMT2A
SCHEMBL5386210 0.85 ALDH1A1 (0.46) ALDH1A1TDP1CYP3A4TSHRKMT2A
SCHEMBL9515040 0.83 HSD17B10 (0.47) ALDH1A1TDP1CYP3A4TSHRKMT2A
SCHEMBL22554694 0.83 HSD17B10 (0.47) ALDH1A1TDP1CYP3A4TSHRKMT2A
SCHEMBL2755203 0.82 ALDH1A1 (0.39) ALDH1A1TDP1CYP3A4TSHRKMT2A
SCHEMBL2770647 0.76 ALDH1A1 (0.44) ALDH1A1TDP1CYP3A4TSHRKMT2A
SCHEMBL29433029 0.75 CASP1 (0.42) ALDH1A1TDP1CYP3A4TSHRKMT2A
SCHEMBL33893 0.75 CASP1 (0.42) ALDH1A1TDP1CYP3A4TSHRKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3590991-B1 EPOXY RESIN COMPOSITION, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES (JP) 2024-05-01 EP disclosed
US-11319435-B2 Heat-curable resin composition, prepreg, and fiber-reinforced composite material TORAY INDUSTRIES, INC. (JP) 2022-05-03 US disclosed
EP-3760661-A1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL Toray Industries, Inc. (JP) 2021-01-06 EP disclosed
US-20200399462-A1 HEAT-CURABLE RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2020-12-24 US disclosed