SCHEMBL22821605

SCHEMBL22821605

CSC(=S)c1ccc(CSC(=S)S)cc1

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ NOS1 P29475 2/20 0.35
▸ IDO1 P14902 12/20 0.34
▸ CA12 O43570 1/20 0.34
▸ CA1 P00915 1/20 0.34
▸ CA2 P00918 1/20 0.34
▸ CA9 Q16790 1/20 0.34
▸ HDAC3 O15379 2/20 0.34
▸ HDAC4 P56524 2/20 0.34
▸ HDAC1 Q13547 2/20 0.34
▸ HDAC7 Q8WUI4 2/20 0.34
▸ HDAC2 Q92769 2/20 0.34
▸ HDAC10 Q969S8 2/20 0.34
▸ HDAC11 Q96DB2 2/20 0.34
▸ HDAC8 Q9BY41 2/20 0.34
▸ HDAC6 Q9UBN7 2/20 0.34
▸ HDAC9 Q9UKV0 2/20 0.34
▸ HDAC5 Q9UQL6 2/20 0.34
▸ SMN1; SMN2 Q16637 2/20 0.33
▸ KDM4E B2RXH2 1/20 0.33
▸ MEN1 O00255 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11436967 0.77 IDO1 (0.57) NOS1IDO1CA12CA1CA2
SCHEMBL20006580 0.73 TAAR1 (0.43) IDO1HDAC3HDAC4HDAC1HDAC7
SCHEMBL11444333 0.73 IDO1 (0.57) NOS1IDO1CA12CA1CA2
SCHEMBL11438280 0.73 IDO1 (0.61) IDO1SMN1; SMN2KDM4E
SCHEMBL5831401 0.73 ALDH1A1 (0.44) IDO1SMN1; SMN2KDM4EMEN1KMT2A
SCHEMBL13046869 0.72 CA12 (0.61) NOS1IDO1CA12CA1CA2
SCHEMBL26471954 0.70 NOS1 (0.44) NOS1IDO1CA12CA1CA2
SCHEMBL19148630 0.69 ALDH1A1 (0.41) NOS1IDO1CA12CA1CA2
SCHEMBL28693687 0.68 NPC1 (0.39) SMN1; SMN2MEN1NPC1RAB9AKMT2A
SCHEMBL4386352 0.68 CA12 (0.50) NOS1IDO1CA12CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200401047-A1 UNDERLAYER FILM-FORMING COMPOSITION, PATTERN-FORMING METHOD, COPOLYMER, AND MONOMER FOR UNDERLAYER FILM-FORMING COMPOSITION Oji Holdings Corporation (JP) 2020-12-24 — — US disclosed
US-20200401044-A1 PATTERN-FORMING MATERIAL, PATTERN-FORMING METHOD, AND MONOMER FOR PATTERN-FORMING MATERIAL Oji Holdings Corporation (JP) 2020-12-24 — — US disclosed
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