⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2281732 | 0.85 | — | — | |
| SCHEMBL2955988 | 0.78 | — | — | |
| SCHEMBL2284580 | 0.78 | — | — | |
| SCHEMBL2219638 | 0.71 | AOC1 (0.32) | — | |
| SCHEMBL28740321 | 0.71 | — | — | |
| SCHEMBL18340865 | 0.67 | — | — | |
| SCHEMBL857201 | 0.67 | — | — | |
| SCHEMBL541849 | 0.67 | — | — | |
| SCHEMBL13482301 | 0.67 | — | — | |
| SCHEMBL1958871 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110115116-B | Method for forming solderable solder deposits on contact pads | 德国艾托特克公司 | 2022-05-27 | — | — | CN | disclosed |
| US-11032914-B2 | Method of forming a solderable solder deposit on a contact pad | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-06-08 | — | — | US | disclosed |
| EP-3560304-B1 | METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-02-03 | — | — | EP | disclosed |
| US-20190350088-A1 | METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2019-11-14 | — | — | US | disclosed |
| EP-3560304-A1 | METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD | ATOTECH Deutschland GmbH (DE) | 2019-10-30 | — | — | EP | disclosed |
| CN-110115116-A | Method for forming solderable solder deposits on contact pads | 德国艾托特克公司 | 2019-08-09 | — | — | CN | disclosed |
| EP-2377376-B1 | METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES | ATOTECH DEUTSCHLAND GMBH (DE) | 2019-08-07 | — | — | EP | disclosed |
| US-8507376-B2 | Method to form solder deposits on substrates | ATOTECH DEUTSCHLAND GMBH (DE) | 2013-08-13 | — | — | US | disclosed |
| EP-2377376-A1 | METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES | ATOTECH Deutschland GmbH (DE) | 2011-10-19 | — | — | EP | disclosed |
| US-20110189848-A1 | METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2011-08-04 | — | — | US | disclosed |
| WO-2010046235-A1 | METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES | ATOTECH DEUTSCHLAND GMBH (DE) | 2010-04-29 | — | — | WO | disclosed |