SCHEMBL22912

SCHEMBL22912

O=C(O)c1cccc(CCc2cccc(C(=O)O)c2C(=O)O)c1C(=O)O

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 5/20 0.59
HMGB1 P09429 1/20 0.52
ALDH1A1 P00352 1/20 0.48
ALOX15 P16050 1/20 0.48
BID P55957 4/20 0.46
MCL1 Q07820 4/20 0.46
BCL2L1 Q07817 3/20 0.46
BAK1 Q16611 3/20 0.46
KAT8 Q9H7Z6 3/20 0.46
EP300 Q09472 2/20 0.46
KAT5 Q92993 2/20 0.46
PPARG P37231 1/20 0.46
PPARA Q07869 1/20 0.46
KAT2A Q92830 1/20 0.46
KAT2B Q92831 1/20 0.46
SAE1 Q9UBE0 1/20 0.46
SOX18 P35713 1/20 0.45
AKR1C3 P42330 1/20 0.43
CLCN2 P51788 1/20 0.43
CA12 O43570 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10885451 0.92 BID (0.56) FOLH1HMGB1ALOX15BIDMCL1
SCHEMBL5114102 0.92 FOLH1 (0.56) FOLH1HMGB1ALDH1A1ALOX15BID
SCHEMBL3001321 0.91 FOLH1 (0.55) FOLH1ALDH1A1BIDMCL1BCL2L1
SCHEMBL2549298 0.90 FOLH1 (0.54) FOLH1HMGB1ALDH1A1ALOX15BID
SCHEMBL9330418 0.90 BID (0.58) FOLH1ALOX15BIDMCL1BCL2L1
SCHEMBL211983 0.90 BID (0.58) FOLH1ALOX15BIDMCL1BCL2L1
SCHEMBL29388397 0.90 FOLH1 (0.54) FOLH1HMGB1ALDH1A1ALOX15BID
SCHEMBL18586489 0.88 FOLH1 (0.53) FOLH1HMGB1ALDH1A1ALOX15BID
SCHEMBL6004170 0.88 FOLH1 (0.57) FOLH1HMGB1ALDH1A1ALOX15BID
SCHEMBL31319546 0.88 BID (0.53) FOLH1HMGB1ALOX15BIDMCL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 152 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110873919-B Optical film 住友化学株式会社 2022-08-19 CN claimed
EP-0356172-A2 Epoxy resins containing imido rings, production process thereof, and epoxy resin compositions containing the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-02-28 EP claimed
US-20250277922-A1 OPTICAL LAMINATE AND IMAGE DISPLAY DEVICE HAVING THE SAME DONGWOO FINE-CHEM CO., LTD. (KR) 2025-09-04 US disclosed
EP-4610701-A1 OPTICAL LAMINATE AND IMAGE DISPLAY DEVICE HAVING THE SAME Dongwoo Fine-Chem Co., Ltd. (KR) 2025-09-03 EP disclosed
CN-119769209-A Photoelectric conversion element, ink for producing photoelectric conversion element, method for producing photoelectric conversion element, image sensor, and fingerprint authentication device 住友化学株式会社 2025-04-04 CN disclosed
CN-119575519-A Optical laminate and image display device having the same 东友精细化工有限公司 2025-03-07 CN disclosed
CN-114599739-B Optical film and flexible display device 住友化学株式会社 2024-12-17 CN disclosed
US-20240384116-A1 MODIFIED EPOXY RESIN AND ELECTRODEPOSITION COATING MATERIAL KANSAI PAINT CO., LTD. (JP) 2024-11-21 US disclosed
CN-113429610-B Optical film and flexible display device 住友化学株式会社 2024-10-25 CN disclosed
WO-2024214314-A1 POLYIMIDE TUBE 株式会社アイ.エス.テイ 2024-10-17 WO disclosed
US-20240343866-A1 POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM, AND PRINTED CIRCUIT BOARD TAMURA CORPORATION (JP) 2024-10-17 US disclosed
EP-0661347-A1 Polyimide resin composition having excellent fatigue resistance and injection molded article of same MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-07-05 EP disclosed
US-5406124-A Thermoplastic polyimides MITSUI TOATSU CHEMICALS, INC. (JP) 1995-04-11 US disclosed
EP-0636661-A1 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-02-01 EP disclosed
EP-0605112-A2 Insulating adhesive tape, and lead frame and semiconductor device employing the tape MITSUI TOATSU CHEMICALS, Inc. (JP) 1994-07-06 EP disclosed
US-5321096-A Good processability and heat stability MITSUI TOATSU CHEMICAL, INCORPORATED (JP) 1994-06-14 US disclosed
EP-0564299-A2 Polyimide composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-10-06 EP disclosed
EP-0422379-A2 Thermosetting resin composition, resin sheet, prepreg and laminated sheet NITTO DENKO CORPORATION (JP) 1991-04-17 EP disclosed
EP-0368590-A2 Production process for polyimide fibers MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-05-16 EP disclosed
EP-0356172-A2 Epoxy resins containing imido rings, production process thereof, and epoxy resin compositions containing the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-02-28 EP disclosed